Conductive Adhesive suits high-vacuum, high-temperature work.
Press Release Summary:
Formulated using high-purity silver flake, Aremco-Bond(TM) 556 is used to produce electronic and high-vacuum components for applications to 340°F. Product sets at room temperature in 24 hr or can be heat cured in 2 or 4 hr at 210 or 170°F respectively. Silver-filled, electrically and thermally conductive, 2-part adhesive exhibits 0.0052 ohm-cm volume resistivity at room temperature and 65.0 Btu-in/hr-ft²-°F thermal conductivity. Tensile shear strength is 2,500 psi.
Original Press Release:
Aremco-Bond 556 Electrically Conductive Adhesive Now Available
Valley Cottage, NY - September 30, 2005
SUMMARY
Aremco-Bond(TM) 556, a new silver-filled, high temperature, electrically and thermally conductive adhesive developed by Aremco Products, Inc., is now used produce electronic and high vacuum components for applications to 340 °F (141 °F).
FEATURES
Aremco-Bond(TM) 556 is an advanced, two-part, conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of 0.0052 ohm-cm at room temperature and a thermal conductivity of 65.0 Btu-in/hr-ft2-°F. The tensile shear strength is 2,500 psi.
Aremco-Bond 556(TM) mixes easily in a 1-to-1 ratio by weight or volume. It sets at room temperature in 24 hours or can be heat cured in 4 hours at 170 °F or 2 hours at 210 °F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes.
Typical applications for Aremco-Bond(TM) 556 include sensors used in high vacuum systems, high temperature connectors and specialty lighting, electronic, and semiconductor components.
For more information about this advanced product, please contact Aremco's Technical Sales Department.
