Master Bond, Inc.
Hackensack, NJ 07601-3950
New EP17HTS-DA Die Attach Epoxy Meets MIL-STD-883J Requirements
Offers high die shear strength of 35-40 kg-f at room temperature that is electrically conductive and can withstands high temperatures. Features low volume resistivity of less than 0.005 ohm-cm. Requires heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.
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New Epoxy Polysulfide Adhesive Resists Temperatures up to 350 degree F
EP21TPHT offers high lap shear strength of 1,600-1,800 psi and bonds to a variety of substrates including metals, composites and rubbers. Withstands exposure to a wide range of chemicals including but not limited to fuels, oils, hydrocarbons and hydraulic fluids. Available for use in double barrel syringes and gun dispensers as well as in 1/2 pint, pint, quart or gallon container kits.
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Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications
Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance with the EU directive 2015/863/EU. EP30DPBFMed is resistant to thermal cycling and sterilization,...
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New Supreme 112 Epoxy from Master Bond Provides High Bond Strength and Reliable Electrical Insulation
Offers low viscosity of 50-200 cps, long open time of 2-3 days at room temperature and is ideal for bonding, sealing, potting and impregnation applications. Features high glass transition temperature of 190-195°C and is serviceable up to 288°C (550°F). Requires three step oven curing process of 1-2 hours at 200°F, followed by 3-4 hours at 250°F and then 4-6 hours at 300°F.
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UV Curing Adhesive Passes NASA Low Outgassing Specifications
Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications. UV10TK40M is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (Tg) of 135-140°C and is serviceable from -60°F to +450°F. Its hardness upon curing is 75-85 Shore D. “Not only does it meet NASA low...
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New Supreme 3CCM-85 Single Component Epoxy Cures within 2-3 Hours at 175-185 degree F
Designed for glob top and chip coating applications. Features high volume resistivity of more than 10^14 ohm-cm and thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m•K)]. Available for use in common size syringes ranging from 10 cc to 30 cc as well as in standard size containers.
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New Supreme 17HT Provides Moderate Viscosity of 100,000-150,000 cps
Features high glass transition temperature of 410°F (210°C). Includes volume resistivity of over 1015 ohm-cm at ambient temperatures and over 1012 ohm-cm at 400°F. Available in 1/2 pint to 5-gallon containers as well as packaging including cartridges and syringes.
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New Master Bond UV22DC80-1Med Features Optical Clarity, Abrasion Resistance and Dimensional Stability
Provides low shrinkage upon cure, abrasion resistance and dimensional stability with low coefficient of thermal expansion of 30-35 x 10-6 inch/inch/°C. Features volume resistivity of more than 1014 ohm-cm and dielectric constant of 3.85 at 60 Hz. Ideal for 30 cc EFD syringes, ½ pint, pint and quart containers applications.
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Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume...
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New LED405Med LED Curable Adhesive Meets ISO 10993-5 Cytotoxicity Standards
The LED405Med LED Curable Adhesive exhibits a thermal expansion of 35-40 in/in x 10^-6/°C and cures to a hardness of 65-75 Shore D. The product features a refractive index of 1.50, volume resistivity of more than 10^14 ohm-cm and dielectric constant of 4.2 at 60 Hz. The adhesive is used in -60°F to +250°F temperature range and cures upon exposure to a 405 nm wavelength light source. It is used...
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