Master Bond, Inc.

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
Adhesives & Sealants

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support. “Besides being easy to handle, this system also...

Read More »
Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals
Adhesives & Sealants

Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals

Master Bond EP62-1 is primarily used as an adhesive, sealant or coating. It has the ability to withstand harsh environmental conditions including exposure to acids, bases and solvents. This two part epoxy features thermal stability with a glass transition temperature exceeding 160-165°C. Read More: http://click.skem1.com/click/ja603-bth3q4-13mg5465/ Dimensionally stable, this two part epoxy has...

Read More »
Master Bond EP39MAOHT for Large Potting & Encapsulation Applications
Adhesives & Sealants

Master Bond EP39MAOHT for Large Potting & Encapsulation Applications

EP39MAOHT blends a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This video demonstrates this system’s mixing and flow properties. This room temperature curing system has excellent thermal conductivity and electrical insulation properties. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and...

Read More »
High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Adhesives & Sealants

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated temperatures...

Read More »
Adhesives for Your Specific Needs
Adhesives & Sealants

Adhesives for Your Specific Needs

EP29LPSPAO-1 Black: Passes NASA Low Outgassing Tests EP29LPSPAO-1 Black is a two component, high performance epoxy system with impressive electrical insulation properties and thermal conductivity of 9-10 BTU•in/ft2 •hr•°F. It is serviceable at temperatures as low as 4K. This adhesive, sealant, coating and encapsulant is also able to withstand cryogenic shocks (i.e. room temperature down to...

Read More »
One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications
Adhesives & Sealants

One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications

Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. “This specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics. Surfaces primed with X21Med are...

Read More »
Top Five Thermally Conductive Adhesives
Adhesives & Sealants

Top Five Thermally Conductive Adhesives

EP36AO: Flexible Epoxy for Potting and Encapsulation Applications B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -100°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers...

Read More »
Newly Developed Products of 2017
Adhesives & Sealants

Newly Developed Products of 2017

EP62-1BF: Low Viscosity Epoxy With Exceptional Chemical Resistance EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to used for potting small components. EP62-1BF is thermally stable and has a glass...

Read More »
Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications
Adhesives & Sealants

Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications

Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support. “Its toughness lessens the chance of stress...

Read More »

All Topics