Master Bond, Inc.

Epoxy Compound withstands exposure to thermal cycling.
Adhesives & Sealants

Epoxy Compound withstands exposure to thermal cycling.

EP30FL Epoxy Potting and Encapsulation compound has low viscosity and can be used in both thick and thin cross sections. Generating low exotherm during cure, it cures at room temperature with low shrinkage. Electrically insulated compound adheres to both similar and dissimilar substrates, is 100% reactive, does not contain any volatiles, and withstands mechanical shock and vibration.

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Epoxy Adhesive cures in 5 minutes.
Adhesives & Sealants

Epoxy Adhesive cures in 5 minutes.

With 1:1 mix ratio, EP51ND 2-component epoxy adhesive can be applied on vertical surfaces without dripping or flowing. It spreads evenly and smoothly, and only contact pressure is required for cure. Product gels in ~5 min and cures fully at ambient temperatures. Bonded parts can be safely handled within Â-½ hr. Adhesive exhibits thermal shock and chemical resistance, and hardened product acts...

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Elastomer offers abrasion and chemical resistance.
Materials

Elastomer offers abrasion and chemical resistance.

Type EP30D-9 cures at room temperature or more rapidly at elevated temperatures. It has 100:15 mix ratio by weight and can be applied evenly on vertical surfaces without dripping. Suited for bonding, sealing, casting, and encapsulation, compound resists exposure to water, salts, alkalis, and acids over temperature range of -60 to 250Â-

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