Master Bond, Inc.
Hackensack, NJ 07601-3950
Instant-Cure Cyanoacrylate Adhesive forms strong bonds.
Formulated to produce bonds with shear as high as 2,800 psi, MB297 is supplied as viscous liquid adhesive with viscosity of 2,000-2,400 cps at 20-
Read More »UV Adhesive is USP Class VI approved for medical devices.
Suited for metals, glass, ceramics, and most plastics, optically clear UV10MED is 100% reactive and does not contain solvents or other volatiles. One-part adhesive has cure times ranging from 5-10 sec upon exposure to UV lamp to 2-3 minutes at ambient temperatures. Service operating temperature range is -60 to 250-
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UV Curable Adhesive targets medical device manufacturing.
Adhering to metals, glass, ceramics, and most plastics, optically clear UV10MED is USP Class VI approved, resistant to chemicals and sterilants, and has service operating temperature of -60 to 250-
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Epoxy Resin System passes NASA's low outgassing test.
With ability to withstand temperatures up to 500-
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Epoxy Adhesive is suited for cryogenic applications.
With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165-
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Epoxy Resin offers dimensional stability.
Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic...
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Epoxy Resin resists temperatures up to 500
Designed for use in high performance composite structures and potting/casting applications, polyfunctional epoxy resin EP34CA can be combined with hardeners to provide low viscosity liquid which is suited for filament windings. Mechanical properties vs. time/temperature of unidirectional graphite composites based on Modmore Type II T fiber and matrix of EP34CA/EP34C yield flexural strength of...
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Polymer System cures by UV light and/or heat.
One component, optically clear, non-yellowing UV15-7DC is designed for bonding, sealing, and coating applications. Cure times range from 5 sec to 2-3 min depending upon wave length, intensity of UV light, and thickness being cured. Heat curing schedules are 10-30 min at 250-260-
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Silicone Potting Compound assures complete fill-in.
Suitable for casting, potting, and encapsulation, 2-component MasterSil 151 cures at room temperature or more rapidly at elevated temperatures. It features elongation at break of 160%, Shore A hardness of 45, and dielectric strength of 460 V/mil. Optically clear product offers resistance to vibration, impact, shock, and thermal cycling. With service operating temperature range of -65 to +400-
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Potting Compound has flexible, low-viscosity formulation.
Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...
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