Master Bond, Inc.

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
Adhesives & Sealants

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...

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Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
Adhesives & Sealants

Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or...

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Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
Adhesives & Sealants

Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or...

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Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
Adhesives & Sealants

Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System

Master Bond EP41S-5ND Black is a two part, NASA low outgassing rated epoxy, with outstanding chemical resistance to acids, bases, alcohols and fuels. Most significantly it will withstand liquid immersion to harsh chemicals such as methylene chloride, phenol (10%) and nitric acid (30%). This system contains no solvents and cures at room temperature, or more rapidly at elevated temperatures. It...

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