Master Bond, Inc.
Hackensack, NJ 07601-3950
Flexible Adhesive/Sealant meets USP Class VI requirements.
Optically clear, UV-curable UV15X-6 polymer system adheres to various substrates, including plastics and elastomers. Suited for medical device assemblies, single-component urethane formulation is 100% reactive, does not contain any volatiles, and also acts as electrical insulator. Cure is not affected by air or moisture, and cured material exhibits abrasion resistance. Bonds resist exposure to...
Read More »Epoxy Potting Compound provides electrical insulation.
Two-component EP121AO-1 offers thermal conductivity as well as thermal and dimensional stability. It features chemical resistance even when exposed to adverse environmental conditions. Service operating temperature is 475-500Ã-
Read More »Silver Conductive Epoxy Adhesive sets up in 5-10 minutes.
Suited for similar and dissimilar substrates, EP77M-F forms bonds that are resistant to thermal cycling and chemicals. Full cure takes 8-12 hr at room temperature, and electrical conductivity is first detectable within 30-60 min. With low volume resistivity of 10-3 ohm-cm, 2-component, silver-filled, 100% reactive epoxy adhesive has 4Ã-
Read More »Adhesive/Sealant bonds dissimilar substrates.
Cured at room or elevated temperatures, 2-component EP21TDCHT-1 has temperature range serviceability of -100 to +400Ã-
Read More »Epoxy Adhesive/Sealant/Coating is chemical-resistant.
Featuring thermal stability, 2-component EP21ARHT-1 is 100% reactive and does not contain any solvents or diluents. It has 2:1 mix ratio by weight and cures at room temperature. Exhibiting minimal shrinkage upon cure, product does not sag or drip on vertical surfaces. Designed to withstand thermal shock and abrasion, it adheres to metals, glass, ceramics, cements, woods, vulcanized rubbers, and...
Read More »UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.
Suited for bonding, sealing, and coating, UV16 single-component, epoxy resin based polymer system bonds to plastics, glass, ceramics, and metals. Product is 100% reactive and does not contain any solvents or other volatiles. With operating temperature range of -60 to +300Ã-
Read More »Epoxy Adhesive suits cryogenic applications.
Two-component, EP51FL epoxy resin system features 1:1 mix ratio, cures rapidly at room temperature, and has setup time of 30-40 min. Product is 100% reactive and emits no solvents or volatiles during cure. It bonds to metals, glass, ceramics, wood, various rubbers, and most plastics. Cured compound exhibits peel strength of more than 25 pli along with elongation of greater than 125%. Offering...
Read More »Silicone Compound is electrically conductive.
Suited for bonding and sealing applications, 2-component, graphite-filled Master Sil 155 has 1:1 mix ratio by weight and cures at ambient temperatures or with heat. Controlled viscosity of silicone elastomer formulation produces smooth paste for complete fill-in around complicated contours. Compound exhibits elongation greater than 300%, resistance to shock and vibration, and less than 0.15%...
Read More »Epoxy adheres to glass, polycarbonates, and acrylics.
Suited for bonding, sealing, coating, encapsulation, and casting, EP30P transparent, 2-component epoxy system cures at room temperature, which can be accelerated by use of heat. Electrically insulating, 100% reactive system contains no solvents or diluents and exhibits minimal linear shrinkage upon cure. With tensile strength that exceeds 9,500 psi, product has mixed viscosity of 1,200-1,400 cps...
Read More »Epoxy provides high thermal conductivity.
Type EP34AN room temperature cure, 2-component epoxy adhesive/sealant, with thermal conductivity of 22-24 BTU/in/ftÃ-²/hr/Ã-
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