Epoxy Adhesive passes NASA outgassing tests.
Press Release Summary:
With operating temperature of 4°K to 400°F, thermally conductive, electrically insulative EP21TCHT-1 cures at room temperature or more rapidly at elevated temperatures. It features mix ratio of 100:60 by weight and mixed viscosity of light paste. Product is 100% reactive and does not contain solvents or diluents. It adheres to metals, ceramics, glass, wood, vulcanized rubbers, and most plastics, and withstands exposure to water, fuels, and most organic solvents.
Original Press Release:
High Temperature Resistant, Thermally Conductive Adhesive Passes NASA Outgassing Tests
Master Bond Inc., Hackensack, N.J. has developed a new two component, thermally conductive, electrically insulative epoxy adhesive called EP21TCHT-1. This compound passes NASA low outgassing specifications and has a service operating temperature range of 4°K up to 400°F. It is formulated to cure at room temperatuire or more rapidly at elevated temperatuires. EP21TCHT-1 has a mix ratio of 100 to 60 by weight and has a mixed viscosity of light paste. It is 100% reactive and does not contain any solvents or diluents.
Master Bond EP21TCHT-1 is durable and has high physical strength properties. It has excellent adhesion to metals, ceramics, glass, wood, vulcanized rubbers, and most plastics. EP21TCHT-1 also exhibits resistance to thermal cycling and can withstand exposure to water, fuels and most organic solvents. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible.
EP21TCHT-1 exhibits a tensile shear strengh, aluminum to aluminum of 2,200 psi. It has a Shore D hardness of >80 and a coefficient of thermal expansion of 18-20 in/in x 10-6°C. Additionally, its dielectric strength is 420 volts/mil and its thermal conductivity is 10 BTU/in/ft²/hr/°F.
Master Bond EP21TCHT-1 is available for use in 1/2 pint, pint, quart, gallon, and 5 gallon container kits.
