Master Bond, Inc.

Applications in Research Labs and Commercial Use for EP29LPSP
Adhesives & Sealants

Applications in Research Labs and Commercial Use for EP29LPSP

Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. In over a dozen published research articles, patents, and manufacturers’ specifications, scientists and engineers have identified EP29LPSP for use in...

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Master Bond EP110F8-5 Epoxy offers pot life of 2-3 days.
Adhesives & Sealants

Master Bond EP110F8-5 Epoxy offers pot life of 2-3 days.

Master Bond EP110F8-5 Epoxy offers Shore D hardness of 70-80 and elongation of 40-60%. Unit is operated in a temperature range of -100°F to +300°F and is available in ½ pint, pint, quart, one and 5 gallon containers. Product provides volume resistivity more than 1015 ohm-cm, dielectric constant of 2.91 and a dissipation factor of 0.009 at 1 KHz. Master Bond EP110F8-5 can stick on metals,...

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Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Adhesives & Sealants

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life

Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing epoxy...

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Finding Strongest Adhesives for Nylon Bonding
Adhesives & Sealants

Finding Strongest Adhesives for Nylon Bonding

Lap Shear Strength of Adhesives for Nylon to Nylon Bonding Master Bond tested the tensile lap shear strength of several epoxy products to determine their capability in nylon to nylon bonding applications. The testing produced impressive results with many systems delivering high values. While high strength is often crucial, each system also offers a diverse range of other properties that must be...

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EP39-2 Adhesive Aids in Photoelectrochemical Application
Adhesives & Sealants

EP39-2 Adhesive Aids in Photoelectrochemical Application

Master Bond EP39-2 features excellent clarity and light transmission properties. It offers superior wear and chemical resistance over the wide service temperature range of -60°F to 300°F. These characteristics proved to be especially useful in a research application performed by the University of Hawaii. The epoxy was used in the development and assembly of photoelectrochemical (PEC) systems to...

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One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
Adhesives & Sealants

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support. “Besides being easy to handle, this system also...

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Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals
Adhesives & Sealants

Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals

Master Bond EP62-1 is primarily used as an adhesive, sealant or coating. It has the ability to withstand harsh environmental conditions including exposure to acids, bases and solvents. This two part epoxy features thermal stability with a glass transition temperature exceeding 160-165°C. Read More: http://click.skem1.com/click/ja603-bth3q4-13mg5465/ Dimensionally stable, this two part epoxy has...

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Master Bond EP39MAOHT for Large Potting & Encapsulation Applications
Adhesives & Sealants

Master Bond EP39MAOHT for Large Potting & Encapsulation Applications

EP39MAOHT blends a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This video demonstrates this system’s mixing and flow properties. This room temperature curing system has excellent thermal conductivity and electrical insulation properties. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and...

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High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Adhesives & Sealants

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated temperatures...

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