Master Bond, Inc.

Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C
Adhesives & Sealants

Chemical Resistant, Two Part Epoxy Features Glass Transition Temperature of +240°C

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100 to 50 ratio by weight. The mixed system is a malleable paste, with an...

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Adhesives & Sealants

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications

Well suited for use in vacuum environments, Master Bond MasterSil 973S-LO is an adhesive, sealant and coating that passes NASA low outgassing tests. This electrically conductive, two component silicone can be used in the aerospace, electronic, opto-electronic and specialty OEM industries. Featuring a low volume resistivity of 0.004 ohm-cm, MasterSil 973S-LO is a silver filled compound that has a...

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Adhesives & Sealants

Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission

Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm. This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile...

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Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...

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Conductive Adhesive/Sealant passes NASA low outgassing tests.
Adhesives & Sealants

Conductive Adhesive/Sealant passes NASA low outgassing tests.

Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include...

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Adhesives & Sealants

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•Ã‚°F [1.30-1.44 W/(mÂ-·K) and a volume...

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Adhesives & Sealants

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...

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Adhesives & Sealants

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has...

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Adhesives & Sealants

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which...

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Adhesives & Sealants

One-Component Epoxy Adhesive meets NASA outgassing specifications.

Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TCÂ- contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•Ã‚°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse...

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