Master Bond, Inc.
Hackensack, NJ 07601-3950
UL Certified Epoxy Encapsulant Resists Arcing without Igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and...
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Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...
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New EP62-1HTMed Epoxy with Working Life of 12 to 24 Hours
Features high temperature, chemically resistant and good flow properties. Offers tensile strength of 10,000-11,000 psi and adheres well to various similar and dissimilar substrates. Can withstand exposure to gamma radiation, ethylene oxide, bleach and other aggressive sterilants or chemicals.
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New LED405FL3 Adhesive with Refractive Index of 1.51
A single component, LED curing adhesive, sealant, coating and encapsulating compound. Properties include electrical insulation as well as resistance to thermal cycling, shock and vibration. RoHS compliant compound, solvent free and available in syringes, ½ pint, pint and quart containers.
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New Graphite Filled Epoxy with Curing Temperature of 80 Degree Celsius
Provides good lubrication and can be employed for static dissipation and EMI/RFI shielding applications. Designed for heat-sensitive electronic applications where high levels of conductivity are desired. Suitable for bonding, sealing and coating.
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Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or...
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Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
Master Bond EP41S-5ND Black is a two part, NASA low outgassing rated epoxy, with outstanding chemical resistance to acids, bases, alcohols and fuels. Most significantly it will withstand liquid immersion to harsh chemicals such as methylene chloride, phenol (10%) and nitric acid (30%). This system contains no solvents and cures at room temperature, or more rapidly at elevated temperatures. It...
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Optically Clear Epoxy Passes ISO 10993-5 Certification for Cytotoxicity
Master Bond EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. This low viscosity system meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. It can be used for bonding, sealing, and small encapsulation applications. It can also be utilized as a coating, especially when...
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New Silicone Adhesive Provides Hardness of 65-75 Shore A
MasterSil 153AO is generically low outgassing and contains no solvents. Features has a long working life of 4 to 6 hours for a 100 gram mass at 75°F. Offers coefficient of thermal expansion of 150-180 x 10-6 in/in/°C.
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Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients
Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and can be utilized for bonding, sealing, coating and potting. As a toughened system, it resists thermal cycling and is ideal for bonding dissimilar substrates. “As part of Master Bond’s sustainability drive, this...
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