Master Bond, Inc.
Hackensack, NJ 07601-3950
Potting Compound withstands temperature extremes.
With thermal conductivity of 25 BTU-in./hr-ft2-Ã-
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Potting Compound has flexible, low-viscosity formulation.
Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...
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Conductive Adhesive withstands severe conditions.
Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300Ã-
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Two-Component Epoxy Adhesive gels in 3 minutes.
Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250Ã-
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Thermally Conductive Epoxy is Exceptionally Flexible
Master Bond Inc. announces the successful culmination of in use trial testing for EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating, and encapsulation. The cured compound exhibits a high, 31% elongation, truly exceptional for a thermal conductive epoxy where the conductivity is a robust 2.6 W/moÃ-
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Silicone Elastomer suits optical and display applications.
Featuring set-up time of 8-12 min at 75Ã-
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Epoxy Adhesive is serviceable at temperatures down to 4-
With 3-minute set-up time, EP51M produces bonds with 2,000+ psi shear strength that exhibits resistance to thermal cycling and chemicals. Bonded parts can be safely handled within 30 min. Product, suited for cryogenic applications, adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Insensitive to cleaning procedures, it can be used in electronic, electrical, computer,...
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Single-Part Epoxy System cures with UV light or heat.
Environmentally friendly UV15DC80, suited for bonding, sealing, coating, and potting, requires no mixing and has 100% solids formulation. Uninhibited by oxygen, chemically resistant epoxy contains no solvents or volatiles and adheres to variety of materials. For thicknesses of .010-.020 in., straight UV curing is accomplished within seconds with UV light at 365 nm with 30-40 mW/cmÃ-² of...
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Adhesive Epoxy has operating range of -65 to 400-
Designed for high performance bonding, sealing, and casting, Model EP21TDC-4HT epoxy compound resists vibration, impact, and shock, and can be room temperature or heat-cured. High physical strength properties include tensile strength of 8250 psi, tensile shear strength of more than 2800 psi, and peel strength exceeding 36 pli at 25Ã-
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Epoxy System resists temperatures up to 400-
Medium-viscosity, 2-component EP30HT has 4:1 mix ratio by weight, is 100% reactive, and does not contain solvents or volatiles. It cures at room temperature or more rapidly at elevated temperatures. Serving as adhesive/sealant, coating, and casting compound, product adheres to metals, glass, ceramics, woods, vulcanized rubbers, and plastics. Optically clear formula has refractive index of 1.54...
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