Master Bond, Inc.
Hackensack, NJ 07601-3950
Potting Compound withstands temperature extremes.
With thermal conductivity of 25 BTU-in./hr-ft2-Ã-
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Silicone Potting Compound assures complete fill-in.
Suitable for casting, potting, and encapsulation, 2-component MasterSil 151 cures at room temperature or more rapidly at elevated temperatures. It features elongation at break of 160%, Shore A hardness of 45, and dielectric strength of 460 V/mil. Optically clear product offers resistance to vibration, impact, shock, and thermal cycling. With service operating temperature range of -65 to +400Ã-
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Potting Compound has flexible, low-viscosity formulation.
Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...
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Conductive Adhesive withstands severe conditions.
Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300Ã-
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Two-Component Epoxy Adhesive gels in 3 minutes.
Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250Ã-
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Epoxy Resin cures at low temperature.
In 6 mil thick films, Master Bond EP27 will set in as little as 2 hr at 40Ã-
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Silicone Elastomer suits optical and display applications.
Featuring set-up time of 8-12 min at 75Ã-
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Epoxy Adhesive is serviceable at temperatures down to 4-
With 3-minute set-up time, EP51M produces bonds with 2,000+ psi shear strength that exhibits resistance to thermal cycling and chemicals. Bonded parts can be safely handled within 30 min. Product, suited for cryogenic applications, adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Insensitive to cleaning procedures, it can be used in electronic, electrical, computer,...
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Single-Part Epoxy System cures with UV light or heat.
Environmentally friendly UV15DC80, suited for bonding, sealing, coating, and potting, requires no mixing and has 100% solids formulation. Uninhibited by oxygen, chemically resistant epoxy contains no solvents or volatiles and adheres to variety of materials. For thicknesses of .010-.020 in., straight UV curing is accomplished within seconds with UV light at 365 nm with 30-40 mW/cmÃ-² of...
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Adhesive Epoxy has operating range of -65 to 400-
Designed for high performance bonding, sealing, and casting, Model EP21TDC-4HT epoxy compound resists vibration, impact, and shock, and can be room temperature or heat-cured. High physical strength properties include tensile strength of 8250 psi, tensile shear strength of more than 2800 psi, and peel strength exceeding 36 pli at 25Ã-
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