New Epoxies Products

Silver-Filled Epoxy Adhesive suits applications up to 480-

Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-Ã-

Epoxy Adhesive suits microelectronic assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90Ã-

Multi-Purpose Repair Epoxy offers syringe-style packaging.

To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed,Ã- epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties,...

Low-Viscosity Epoxy Adhesives offer fast set times.

Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of...

Designing and Specifying the Right Loudspeaker System for Emergency Mass Notification in Public Venues

A guide for designing and implementing effective loudspeaker systems for emergency situations.

Low Thermal Expansion Epoxy passes NASA low outgassing tests.

Formulated with blend of polymeric and inorganic materials, 100% reactive EP30LTE-LO is used for bonding, sealing, casting, and coating applications. This 2-component epoxy exhibits dimensional stability and is serviceable over -60 to +250Ã-

Flexible Epoxy withstands cryogenic conditions.

Serviceable over wide range of 4 K to 250Ã-

Epoxy Adhesive encapsulates sensors in harsh environments.

Combining quartz filler and amine compound, Supreme 45HTQ is suited for bonding and encapsulating transducers, gauges, actuators, and sensors in harsh environments. Epoxy adhesive features tensile strength exceeding 8,500 psi and compressive strength greater than 20,000 psi. Resistant to chemicals, acids, oils, water, and steam, product can withstand long term exposure to 400-500Ã-

Heat Resistant Epoxy Adhesive provides high strength bonds.

Withstanding long-term exposure to wide temperature ranges between -100 and +500Ã-

Two-Component Epoxy Adhesives are electrically conductive.

Type 118-15, 123-39, 124-08, and 125-18 are 100% solids silver-filled epoxy systems designed for attachment of electronic components. Featuring 1:1 mix ratio by weight, RoHS-compliant products are fast curing, resistant to thermal shock, and cure in temperatures as low as 80Ã-

Metal Bonding Epoxy offers optimal shear, peel strengths.

Formulated for service from -73Ã-

How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.