Rogers Corporation
Rogers, CT 06263 0188
Aug 01, 2006 Formulated for technically demanding circuit applications, R/flex JADE Series meets flammability requirements without use of halogens. RoHS-compliant products display thermal stability and can withstand multiple passes through lead-free soldering. Transparent adhesives facilitate optical inspection and are available in bonding film, coverlay, and flexible copper clad laminate constructions. Applications include HDDs, cell phones, laptops, PDAs, and semiconductor packages.

Alfa International Corp.
Woonsocket, RI 02895
Jul 24, 2006 Silver-filled ALFA E10-101 develops electrically conductive bonds and coatings between different and dissimilar materials such as metals, ceramics, glass, and plastic laminates. Smooth paste of refined silver and epoxy, free of solvents and copper or carbon additives, can be used as cold-solder for heat-sensitive components where hot soldering is impractical. It comes in 2-chamber plastic pouches and burst packs, pre-measured jars from 10-500 g, and syringes.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 27, 2006 Master Bond Polymer System Supreme 10HTFL is single-component, epoxy resin-based adhesive/sealant with -300 to +300°F service temperature range. Cured to flexible thermoset polymer at temperatures of 250-300°F and above, product does not require refrigeration for extended storage before use. It adheres to metallic and non-metallic substrates, even upon prolonged exposure to hostile environmental conditions. Product also bonds substrates with different thermal expansion coefficients.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jun 16, 2006 Suited for bonding applications, Aremco-Bond(TM) 860 aluminum nitride-filled, electrically insulating epoxy adheres to high-temperature plastics as well as glass, ceramic, and high-expansion metals. This 2-component, 100% solids material has 1:1 resin to activator mix ratio and cures in 24 hr at room temperature or 2 hr at 200°F. After curing, it exhibits thermal conductivity of 8.5 Btu-in/hr-ft²-°F and dielectric strength of 250 V/mil. Tensile shear strength is 1,375 psi.

Master Bond, Inc.
Hackensack, NJ 07601
Jun 12, 2006 One component, heat curing epoxy adhesive/sealant EP17 cures at temperatures from 300-350°F for 60-90 minutes. Flowable paste has 8,700 psi tensile strength, 387,000 psi tensile modulus, Shore D hardness greater than 90, and compressive strength greater than 13,000 psi. MIL-MMM-A-132 compliant, 100% reactive compound is resistant to chemicals, including fuels and acids, and bonds to metals, glass, ceramics, vulcanized rubbers, and plastics.

Master Bond, Inc.
Hackensack, NJ 07601
May 30, 2006 Master Bond Polymer System EP37-3FLSP bonds to substrates such as metals, glass, ceramics, plastics, and elastomers. Optically clear epoxy features electrical insulation properties and exhibits resistance to vibration, shock, and thermal cycling. Suited for large-volume castings, product has 20 Shore D hardness, 1,000 psi tensile strength, and over 400 V/mil dielectric strength. Pot life after mixing exceeds 10 hr, and full cure occurs within 4-7 days at ambient temperatures.

Master Bond, Inc.
Hackensack, NJ 07601
May 11, 2006 Formulated to setup in 3-5 min in 10-20 g masses at room temperature, EP65HT-1 ultra-fast curing, high temperature resistant epoxy adhesive bonds with metals, glass, ceramics, woods, vulcanized rubbers, and plastics. It has Shore D hardness of >75 and volume resistivity of >1014 ohm-cm. Mixed viscosity is 60-70,000 cps and mix ratio is 10 to 1 by weight. Available in pint, quart, gal, and 5 gal unit kits, EP65HT-1 has service operating temperature of -60 to +400°F.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
May 04, 2006 Material GPC-251A/B is silver-filled, electrically conductive, 2-part, room-temperature curing adhesive used to connect bumps on underside of circuit boards. Product cures in 24 hr @ 25°C, 60 min @ 65°C, and 5 min @ 120°C. Material 123-38A/B-187 is thermally conductive underfill epoxy that strengthens chip package, protecting it from moisture and adding mechanical strength. Product releases entrapped air during cure, resulting in smooth, pinhole-free surface.

Cotronics Corp.
Brooklyn, NY 11232
Apr 11, 2006 Packaged in pre-measured job sized kits, 450°F Machine-IT features sticky consistency that holds assemblies or parts together while curing. Product offers adhesion to smooth, rough, or porous surfaces, and most plastics, metals, ceramics, glass, and wood. Curing in 2-4 hours, epoxy forms hard, metallic composite that can be machined, tapped, drilled, and threaded. Machine-IT is suited for high temperature repairs, rebuilding, and assembling.

Tra-Con, Inc.
Bedford, MA 01730
Mar 29, 2006 TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.

Tra-Con, Inc.
Bedford, MA 01730
Mar 29, 2006 TRA-BOND F113SC epoxy adhesive is formulated for fiber optics, LED displays, lenses and other optical components. It provides high bond strength and low stress connections with no pistoning. Featuring Tg of 95°C, 2-part rigid epoxy system is curable at room temperature or can be heat cured in 15 min. It exhibits low water absorption percentage.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 22, 2006 Two component, room temperature curing, nickel filled, electrically conductive EP76M epoxy adhesive features thermal conductivity of 8-9 Btu/in/ft²/hr/°F. Featuring one to one mix ratio by weight or volume, it offers 5-10 ohm-cm volume resistivity. EP76M exhibits 30 in/in x 10⁶/°C thermal expansion coefficient, and service operating temperature range of -60 to +250°F. Packaged in pint and quart unit sizes, product is 100% reactive and does not contain any diluents or solvents.

Cotronics Corp.
Brooklyn, NY 11232
Mar 17, 2006 Packaged in dispensing cartridges, 450°F Instant Metal 7056AL forms solid metallic aluminum layer that adheres to smooth, rough, or porous surfaces as well as most plastics, metals, ceramics, glass, and wood. It cures in 4-8 min at room temperature without objectionable sulfur odors. Once cured, metallic composite is machinable with standard tools and can also be tapped, drilled, and threaded.

Park Electrochemical Corp
Melville, NY 11747
Feb 27, 2006 Providing users with CAF-resistant FR4 product, 180°C Tg Series N4000-29 laminate and prepreg materials are RoHs compliant and UL approved. These qualities, along with adherence to IPC's proposed IPC-4101/99 lead-free slash sheet, make substrates suitable for lead-free or high reliability applications.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 24, 2006 Designed for bonding, sealing, and casting engineering plastics and metals, EP40 cures at ambient or elevated temperatures with 1:1 mix ratio by weight or volume. Flexible, 2-component epoxy resin compound is resistant to thermal cycling as well as mechanical vibration and shock. Shear and peel strengths for bonding polycarbonates are 1000 psi and 20 pli, respectively, while steel and aluminum bonds yield shear strength values up to 1,800 and 1,500 psi.

Tra-Con, Inc.
Bedford, MA 01730
Feb 21, 2006 Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80°C. TRA-CAST 3103 is NASA outgassing approved and has passed cytotoxicity testing.

Ashland, Inc.
Covington, KY 41011
Feb 15, 2006 Engineered to return automobiles to pre-accident condition, PLIOGRIP® by Valvoline body repair system utilizes urethane, epoxy, and MS Polymer technologies. Offering is comprised of 17 core products that are segmented into 4 groups: SMC Repair, Panel Bonding, Plastic Repair, and Sealers and Foams.

Dylon Industries, Inc.
Cleveland, OH 44144
Feb 02, 2006 Two-component Grade RX offers pot life of 3½ hr at room temperature and set time of 6-8 hr without additional heat, while single-component Grade PX consists of heavy paste that must be cured for 30 min at 285-315°F. Both can be used as heat conductive compounds or electrically conductive adhesives. Products can be used to manufacture heat sinks, bond materials for minimum heat loss, or to fill holes and pits in metals. Both can be machined, threaded, drilled, sawed, and buffed.

Devcon
Danvers, MA 01923
Jan 05, 2006 Suited for OEM assembly, SC 2002 NS non-sagging, 1-part epoxy adhesive bonds to fabrics, wood, steel, aluminum, ceramics, glass, and concrete. Self-leveling gel is 100% reactive, requires no mixing, offers gap-filling properties, and produces flexible bonds with thermal stability. At 275°F, SC 2002 NS has fixture time of 1 min. Fully cured bonds exhibit adhesive tensile lap shear of 2,200 psi, resist corrosion, and withstand service temperatures from -60 to 300°F.

Cotronics Corp.
Brooklyn, NY 11232
Dec 28, 2005 Able to adhere to dissimilar substrates, Duralco 4700HT cures at 250°F without outgassing and exhibits electrical resistance and temperature stability. Product is based on cross-linked, inorganic-organic polymer system and features mix and apply functionality. Able to adhere to metals, glass, ceramics, and plastics, it exhibits chemical, solvent, and radiation resistance as well as thermal and mechanical shock resistance.