Cotronics Corp.
Brooklyn, NY 11232
Jun 05, 2007 Able to adhere to plastic surfaces as well as metals, ceramics, and glass, Bond-It 7050 bonds to Nylon, PVC, and dissimilar/difficult-to-bond materials. No special surface preparation is required. Users mix and apply, and product cures at room temperature to form 400°F bonds that exhibit temperature stability as well as electrical, thermal, and chemical resistance. Available in regular or fast-setting grades, activated 400°F epoxy incorporates adhesion promoters into its structure.

Epoxies Etc.
Cranston, RI 02921-3407
May 01, 2007 Impact resistant epoxy adhesive Type 10-3216 bonds to metals, woods, plastics, rubbers, and masonry products. Featuring 1:1 mix ratio, it will not crack, and is available in low viscosity translucent version as well as high viscosity gray version. Structural adhesive can be used in cryogenic bonding and is suitable for many aircraft and aerospace applications.

Master Bond, Inc.
Hackensack, NJ 07601
Apr 11, 2007 Providing resistance to water and chemicals, 2-component EP37LV-1 Polymer System features tensile strength in excess of 8,300 psi, working life of 30 min at room temperature, and final mix viscosity of 5,000 cps. Full cures are obtained in 8-10 hr, while complete cures take longer at lower temperatures. Applications range from grouting, troweling and concrete patching in damp locations to marine coatings, floor toppings, and solder substitutes for copper pipe joints.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Mar 13, 2007 Pre-applied to board at corners of CSP pad site using standard dispensing system, one-component Loctite® Cornerbond(TM) 3508 cures during normal lead-free solder reflow, allowing for self-alignment of IC components. It provides 6-month shelf life, pot life greater than 75 hr, and ability to use standard refrigerated storage. Reworkable feature enables defective components to be removed without requiring entire assembly to be scrapped.

Huntsman Advanced Materials
Los Angeles, CA 90039-1011
Mar 08, 2007 Featuring chemical and moisture resistance, ARALDITE® Epoxy Adhesives are suitable for bonding and potting electronic components. Room temperature- and elevated temperature-curing products are RoHS-compliant and sag resistant. Providing lap shear strength, high-temperature ARALDITE® Polyurethane Adhesives can bond hard-to-join thermoplastic substrates and encapsulate pressure-sensitive components. All come in dual-barrel cartridges as well as bulk packaging for automated mixing/dispensing.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 02, 2007 With service temperature range of -60°F to over 400°F, Type EP30HT epoxy produces high strength, rigid, chemical resistant bonds, and adheres to similar and dissimilar materials such as metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Product attains shear bond strengths over 3,200 psi, with volume resistivity greater than 1,015 W-cm, dielectric strength of 440 V/mil, and dielectric constant of 3.46 at 1 MHz.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 09, 2007 Suitable for use in both thick/thin sectioned configurations, EP21TDC-2LO bonding, sealing, coating, and encapsulation system has thermal conductivity of 9 BTU/in./ft²/hr/°F and volume resistivity of 1,012 Wcm. With service operating temperature range of 4 K to 250°F, room temperature curable product features Shore D hardness of 36, elongation of 50%, 1:3 mix ratio by weight or volume, working life of 90 min for 100 g mass, tensile strength of 1,070 psi, and T-peel strength of 15 pli.

Henkel Consumer Adhesives, Inc.
Avon, OH 44011-1355
Jan 23, 2007 Hysol® FP5110 offers adhesion to 2- and 3-layer flexible printed circuits by bonding to polyimide and epoxy adhesive material. It provides an alternative to mechanical soldering by bonding bumps to substrate through lead-free compatible thermal compression process that eliminates need for flux application, reflow, and cleaning. Other features include 10 sec SnapCure at 180°C, storage requirements of -15°C, and compatibility with ultrasonic bonding processes.

Aremco Products, Inc.
Valley Cottage, NY 10989
Jan 05, 2007 Consisting of 2-component, 100% solids, aluminum-filled epoxy, Aremco-Bond(TM) 805 is suited for bonding, potting, and tooling applications. It adheres to high temperature plastics as well as glass, ceramic, and high-expansion metals. Product cures at room temperature in 24 hr or at 200°F in 2 hr. After curing, it exhibits thermal conductivity of 12.5 Btu-in./hr-ft²-°F and dielectric strength of 50 V/mil. Tensile shear and flexural strengths are 1,800 and 15,500 psi, respectively.

Aremco Products, Inc.
Valley Cottage, NY 10989
Nov 27, 2006 Used in applications requiring bond strengths up to 4,770 psi, 2-part, ceramic-filled Aremco-Bond(TM) 2310 is gray-pigmented, 100% solids epoxy adhesive with flexural strength of 12,000 psi, volume resistivity of 3.0 x 10¹³, dielectric strength of 410 V/mil, and dielectric constant of 4.28 at 1 kHz. Cured product exhibits linear shrinkage of .001 in./in. and Shore-D hardness of 78. Recommended cure is 2 hours at 150°F or 48 hr at room temperature.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 20, 2006 With 3-minute set-up time, EP51M produces bonds with 2,000+ psi shear strength that exhibits resistance to thermal cycling and chemicals. Bonded parts can be safely handled within 30 min. Product, suited for cryogenic applications, adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics. Insensitive to cleaning procedures, it can be used in electronic, electrical, computer, construction, metalworking, appliance, automotive, and chemical industries.

Superior Epoxies & Coatings, Inc.
Decatur, GA 30035
Oct 19, 2006 Featuring 100% solids formulation, chemical-resistant Superior Cove Kit is designed for vertical application at floor-wall joints to produce sanitary perimeter seal. This structural epoxy mortar, packaged in pre-measured kits to cover 35 lineal feet (4 in. vertical and 2 ft horizontal at 1/8 in.), requires clean surface prepared via sand blasting, water blasting, or other mechanical means. Each kit contains binder and blended aggregate in plastic mixing container.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 18, 2006 Environmentally friendly UV15DC80, suited for bonding, sealing, coating, and potting, requires no mixing and has 100% solids formulation. Uninhibited by oxygen, chemically resistant epoxy contains no solvents or volatiles and adheres to variety of materials. For thicknesses of .010-.020 in., straight UV curing is accomplished within seconds with UV light at 365 nm with 30-40 mW/cm² of energy. Product also cures in shadowed areas with supplemental heat at 80°C for 15-30 min.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 02, 2006 Designed for high performance bonding, sealing, and casting, Model EP21TDC-4HT epoxy compound resists vibration, impact, and shock, and can be room temperature or heat-cured. High physical strength properties include tensile strength of 8250 psi, tensile shear strength of more than 2800 psi, and peel strength exceeding 36 pli at 25°C. Featuring volume resistivity greater than 1014 ohm-cm, two-part epoxy bonds with metals, glass, ceramics, wood, vulcanized rubbers, and most plastics.

efi Polymers
Denver, CO 80216
Sep 29, 2006 Offering 1,000 cp mixed viscosity, 20206/50013 Electrical Potting System is used for automated encapsulation of motors and electronic parts. Thermally-conductive epoxy cures at room temperature with cure cycles of 24 hr at 77°F or 4 hr at 150°F, has gel time of less than 5 hr at 77°F or 45 minutes at 120°F, and working time of 150 minutes at 77°F. UL 1446 recognized potting compound features volume resistivity of 2.8 x 1015 W-cm and dielectric strength of 456 V/mil.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 27, 2006 Medium-viscosity, 2-component EP30HT has 4:1 mix ratio by weight, is 100% reactive, and does not contain solvents or volatiles. It cures at room temperature or more rapidly at elevated temperatures. Serving as adhesive/sealant, coating, and casting compound, product adheres to metals, glass, ceramics, woods, vulcanized rubbers, and plastics. Optically clear formula has refractive index of 1.54 and spectral transmittance of 97%. It resists exposure to water, oil, and organic solvents.

Master Bond, Inc.
Hackensack, NJ 07601
Sep 14, 2006 Formulated to withstand repeated cycles of steam, ethylene oxide, radiation, and chemical sterilization, EP62-1MED 2-component epoxy adhesive system cures at 150-200°F temperatures and is serviceable up to 400°F. USP Class VI approved adhesive contains no solvents or volatiles and has 100:10 mix ratio by weight. Available in pint, quart, 1 and 5 gal kits, product exhibits less than 0.06% shrinkage after cure.

Tra-Con, Inc.
Bedford, MA 01730
Sep 01, 2006 Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and alkalis, salt solutions, and other organic and inorganic compounds.

Tra-Con, Inc.
Bedford, MA 01730
Sep 01, 2006 Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical, rather than chemical, bond.

Master Bond, Inc.
Hackensack, NJ 07601
Aug 24, 2006 Model EP21 2-component, room temperature curing, epoxy adhesive allows adjustment of properties by altering mix ratio. Adhesive holds up to thermal cycling and resists chemicals including water, oils, fuels, acids, bases, and salts. With gap filling properties and operating temperature of -60 to 250°F, adhesive bonds to variety of substrates and does not contain any diluents or solvents.