Sherwin-Williams
Cleveland, OH 44115
Apr 16, 2008 Free of hazardous air polluting solvents, anti-corrosive SeaGuard 6200 can be applied at temperatures as low as 20°F, making it suited for vessel maintenance during winter lay-up. Product may be used on many prepared steel substrates, including bilges and wet void areas, decks and superstructures, and underwater hulls. Applied by brush, roller, or spray, coating is suited for fabrication and new construction along with maintenance and repair.

Cotronics Corp.
Brooklyn, NY 11232
Apr 09, 2008 Resistant to electricity, chemicals, and moisture, Duralco(TM) 4463 is 100% solid system that exhibits dimensional stability and adheres to glass, ceramics, metals, and plastics. This 500°F epoxy, suited for bonding and encapsulating applications, contains no VOCs and only requires users to mix and apply.

Master Bond, Inc.
Hackensack, NJ 07601
Apr 08, 2008 Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic solvents over temperature range of -65 to +250°F.

Henkel Loctite Corporation
Rocky Hill, CT 06067
Apr 03, 2008 Loctite® 331(TM) Structural Adhesive is acid-free, 2-step acrylic that fixtures in 20 sec and develops full strength in 30 min, bonding magnets and metals of all sizes. Designed for filling large gaps, Loctite® 3060(TM) Structural Adhesive is acid-free, 2-component, external-mix acrylic featuring 2 cascading adhesive streams that automatically mix together. Loctite® E-220IC(TM) Hysol® Epoxy Adhesive is acid-free, 1-component epoxy designed for induction cure operations.

Cotronics Corp.
Brooklyn, NY 11232
Mar 31, 2008 Offering dimensional stability, Duralco(TM) 4463 consists of 100% solid system that is mixed, applied, and cured at room temperature. Product resists electricity, chemicals, and moisture. With low odor and no VOCs, epoxy adheres to most glass, ceramics, metals, and plastics, and is suitable for bonding and encapsulated applications.

Master Bond, Inc.
Hackensack, NJ 07601
Mar 31, 2008 Designed for use in high performance composite structures and potting/casting applications, polyfunctional epoxy resin EP34CA can be combined with hardeners to provide low viscosity liquid which is suited for filament windings. Mechanical properties vs. time/temperature of unidirectional graphite composites based on Modmore Type II T fiber and matrix of EP34CA/EP34C yield flexural strength of 236,000 psi, flexural modulus of 17.8 x 106 psi, and interlaninar shear strength of 12,700 psi.

Creative Materials Inc.
Tyngsboro, MA 01879-2724
Mar 18, 2008 Featuring thermal stability and chemical resistance, 124-34A/B-187 consists of 2-component syringe dispensable, isotropically electrically conductive, epoxy adhesive, while 125-01A/B-187 offers 2-component syringe dispensable, anisotropically conductive version of product. Cure times as fast as 7-10 seconds can be achieved at elevated temperatures. Applications include assembly of electrical and electronic components.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 07, 2008 Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound exhibits electrical insulation properties and resistance to water.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 06, 2008 Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm, surface resistance of less than 1 ohm/square, and thermal conductivity of 7.9 W/meter-°K.

Master Bond, Inc.
Hackensack, NJ 07601
Feb 05, 2008 Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250°F range. Product adheres to metals, glass, ceramics, wood, vulcanized rubbers, and plastics.

Dow Chemical Co., The
Midland, MI 48674-0001
Jan 14, 2008 Suited for use in amine, DICY, anhydride, and phenolic cured epoxy systems, FORTEGRA(TM) Epoxy Tougheners are available in 4 forms, and provide adhesion and corrosion and chemical resistance. FORTEGRA 100 is epoxy toughening agent, while FORTEGRA 383-50 and 383-5 are blends of D.E.R(TM) 383 liquid epoxy resin with 50 and 5 weight percent, respectively, of toughening material. Used in powder coatings, FORTEGRA 664-12 is 12 weight percent blend of toughening material in D.E.R. 664.

Master Bond, Inc.
Hackensack, NJ 07601
Jan 11, 2008 One-component Polymer System EP11HT cures in 110 min at 250°F or 75 min at 300°F. It attains tensile shear strength of greater than 3,300 psi to form rigid and dimensionally stable bonds. Resistant to acids and solvents, service temperature range is -60 to 400°F and it bonds to substrates including metals, glass, ceramics, and plastics. EP11HT is available in pint, quart, 5 gal containers, and non-drip version EP11HTND-2.

Electronics Assembly, Henkel Corporation
Irvine, CA 92618
Dec 12, 2007 Suitable for laptops and gaming consoles that may experience only occasional vibration, 1-component Loctite® 3508 is pre-applied at corners of CSP pad site using standard dispensing system. It can be applied in-line with existing equipment with curing taking place during normal solder reflow process. Reworkable, lead-free compatible material enables total ball collapse and self-alignment properties to compensate for slight component-to-pad misalignment during placement.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 30, 2007 Curing at room temperature when exposed to UV light source, UV22 nanosilica-filled, one-component, UV-curable epoxy is not oxygen inhibited. Abrasion-resistant epoxy has service operating temperature range of -60 to +300°F and adding 195-257°F for 30 min gives it glass transition temperature of 275°F. It has Shore D hardness of greater than 80, tensile strength of greater than 4,600 psi, refractive index of 1.52, and shrinkage of 1-2%.

Power Adhesives Ltd
Basildon, Essex   United Kingdom
Nov 27, 2007 KNOT-TEC(TM) System lets manufacturers of such products as windows, doors, and furniture use entire board, rather than just portions before or knot or defect. Combining TEC(TM) 250 hot melt adhesive applicator and TECBOND(TM) 7718/12 polyamide hot melt glue sticks, system repairs knots and fills wooden surfaces so that they are smooth and unnoticeable prior to painting/finishing. Solution performs repairs in seconds, and any surplus glue can be removed with chisel or cutting tool.

Epoxies Etc.
Cranston, RI 02921-3407
Nov 21, 2007 Formulated with high purity polymers and ultraviolet protectors, Type 20-3302 epoxy system is formulated to minimize yellowing when cured. Curable at room temperature, it features water clear clarity, bubble free castings, and low viscosity for quick self leveling. Available in 2 different viscosities, it is suited for LED potting, fiber optics, and other clear adhesive or encapsulating applications.

Master Bond, Inc.
Hackensack, NJ 07601
Nov 08, 2007 Formulated to cure quickly at ambient temperatures, Supreme65HT-6 produces bonds with tensile lap shear strengths in excess of 3,000 psi for service in temperature range of below -80°F to +400°F. It is resistant to vibration, stress fatigue cracking, moisture, creep, and corrosion. Available in pre-measured bubble packs, cartridges, ½ pint, pint, quart, gallon, and 5 gal containers, unit offers adhesion to metal, glass, ceramics, wood, vulcanized rubbers, and plastics.

Master Bond, Inc.
Hackensack, NJ 07601
Oct 30, 2007 With elongation of greater than 60%, Type EP21TDCSFL is 100% reactive epoxy adhesive that has has 1:1 mix ratio by weight/volume, does not contain diluents/solvents, cures at room temperature, and offers mechanical shock resistance and low outgassing properties. Features include volume resistivity of less than 10^-3 W cm, tensile shear strength of greater than 1,500 psi, T-peel of greater than 30 pli, and thermal conductivity of 11 BTU/in./ft²/hr/°F.

Air Products & Chemicals, Inc.
Allentown, PA 18195
Oct 16, 2007 With zero VOCs, Ancarez(TM) AR555 is suited for floor, institutional, and OEM coating applications. Fast-dry performance optimizes sandability and stackability, while coalescing properties enable uniform film formation, and anti-corrosive attributes make product suitable for providing protection.

Henkel Corp.
Madison Heights, MI 48071
Sep 10, 2007 Hysol FP4581 and FP4583 underfill systems adhere to SiN and polyimide and deliver combination of thermal mechanical characteristics to prevent delamination, bump fatigue, and UBM failure. With low CTE properties, Hysol FP4581 forms rigid, low stress seal that dissipates stress on solder joints. Hysol FP4583 contains fillers that are less than or equal to 2 microns in diameter and is formulated for use with overmolded components in high-lead and lead-free applications.