Master Bond, Inc.
Hackensack, NJ 07601
Feb 07, 2002 Flexible, 2-component EP21TPFL-1 polysulfide elastomer resists fuels, water, and aggressive chemicals. It cures at room temperature, is 100 percent reactive, and does not emit any volatiles during curing. Operating temperature range is -65 to +300 deg F. Thermal- and shock-resistant epoxy is available in 1/2 pint, pint, quart, gallon, and 5 gal kits, and in low and high viscosity versions.

Devcon
Danvers, MA 01923
Jan 22, 2002 Suitable for bonding and potting applications up to 250°F, HP 250 epoxy adhesive is resistant to heat, chemicals, and impact. With viscosity of 105,000 cps, HP 250 thixotropic paste will not sag or run when used on vertical or inverted surfaces. It cures at room temperature, and produces high-strength, durable, nonshrinking bonds. Working time is 65 minutes, tensile shear strength is 3200 psi, and peel strength is 35-40 pli.

Tra-Con, Inc.
Bedford, MA 01730
Jan 17, 2002 TRA-BOND 2125 two-part system is composed of micron-sized glass spheres in epoxy binder. Chemical-resistant adhesive bonds to most surfaces, including metals, building construction products, glass, glass fabrics, and plastics. TRA-BOND 2125 is suitable for use in industrial repair, bonding, and casting applications.

Tra-Con, Inc.
Bedford, MA 01730
Jan 17, 2002 Tra-Bond 293-1T general purpose epoxy adhesive provides strong bonds to difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. It can be cured at moderate temperatures from 60 to 75°C. Tra-Bond 293-1T thixotropic adhesive is available in pre-measured bipax kits or premixed and frozen syringes.

Electronic Materials, Inc.
Breckenridge, CO 80424 8817
Jan 02, 2002 EMCAST FIPG 1850 is curable by UV light in 325-380 nm range. Viscosity is rated at 60,000 cps, and its hardness A rating is 65. EMCAST FIPG 1851 is curable by UV light in 325-380 mn range. Viscosity is rated at 60,000 cps, and its hardness A rating is 80. Emcast FIPG 1852 acrylate based prepolymer is curable by UV light in the 325-380nm range or by heat. Viscosity ranges from 50,000-60,000 cps, and its shore A hardness ranges from 60-65.

Tra-Con, Inc.
Bedford, MA 01730
Dec 20, 2001 Tra-Bond CA20 thixotropic epoxy adhesive system is formulated for shorted turns, damaged end wire extensions, or other coil repair applications where high-fill, non-sag adhesive is needed. It provides high dielectric isolation and good mechanical strength. Readily mixed, handled, used, and cured at room temperature, Tra-Bond CA20 develops strong bonds to materials such as metals, glass, ceramics, coil coatings and insulators.

Cotronics Corp.
Brooklyn, NY 11232
Dec 17, 2001 Epox-Eez(TM) twin pack cartridges are pre-filled, measured and mixed. Adhesive will cure at room temperature, provide 500°F service, and have chemical, electrical and moisture resistance. Epox-Eez cartridges are available for company's General Purpose 4525N, Low Viscosity 4461N, Vibration Resistant 4535N, Fast Set 4537N, Ultra Flexible 4538N, and Machinable Epoxy 4540N high-temperature formulations. Applicator gun is reusable.

Vantico Inc.
East Lansing, MI 48823
Dec 13, 2001 Ren Shape 5008 epoxy board can be machined with carbide cutters to generate molds with good edge definition, dimensional stability, and smooth surface finish. It can be used to produce intermediate-temperature models, heat-resistant thermoform tooling, and lay-up tools for composite parts. Molds may be produced for thermoforming detailed, production-quality parts from polypropylene, polystyrene, polyvinyl chloride, polycarbonate and ABS.

Tra-Con, Inc.
Bedford, MA 01730
Dec 11, 2001 TRA-BOND 2111 thixotropic epoxy resin and hardener formulation is developed for industrial adhesive, staking, laminating, repair, and manufacturing applications where long pot-life, good wetting, non-sag, and non-drip properties are required. Two-part system contains no volatile solvents, and cures at room temperature. It bonds to glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics.

Tra-Con, Inc.
Bedford, MA 01730
Dec 11, 2001 TRA-CAST 3143 has low viscosity, long pot life, and is certified to UL 94 V-O. Epoxy system has low coefficient of thermal expansion and excellent wetting and adhesion to most electronic and aerospace-industry materials, including metals, glass products, ceramics, industrial laminates and many rigid plastics. Applications include rigid potting, laminating, transformer encapsulating, filament winding and coil embedding.

Electronic Materials, Inc.
Breckenridge, CO 80424 8817
Dec 11, 2001 Two component EMCAST 758 thermally conductive epoxy has moderate viscosity of 130,000 cp, glass transition temperature of 125°C, thermal conductivity of 3 W/mK, and is not electrically conductive. It is 100% solids epoxy with no solvent for zero VOCs. Epoxy is available in pre-mixed and frozen syringes or in two component kits with mix ratio of 2:1. Substrates include aluminum, stainless steel, glass and ceramics.

Electronic Materials, Inc.
Breckenridge, CO 80424 8817
Dec 10, 2001 Two component EMCAST has viscosity of 130,000 cps, specific gravity of 1.90, and glass transition temperature of 125ºC. Its thermal conductivity is 3 W/mK, and it is not electrically conductive. 100% solids epoxy has no solvent for zero VOCs. Epoxy cures in 8 hours @ 25°C, 1 hour @ 65°C, and 15 minutes @ 100°C. It is available as pre-mixed and frozen syringes or in two component kits. Mix ratio is 2:1. Epoxy has Rex81D hardness rating.

Tra-Con, Inc.
Bedford, MA 01730
Nov 28, 2001 Two-part Tra-Bond 2116 thixotropic adhesive can be used in electronic and industrial applications where high-fill, non-sag adhesive is needed. It bonds well to many substrates including metals, glass, ceramics, wood, and plastics. Adhesive cures at room temperature, is electrical insulator, and is NASA outgassing approved. It resists chemicals and weather.

Tra-Con, Inc.
Bedford, MA 01730
Nov 21, 2001 Tra-Bond 933-1.5 electrically insulating epoxy encapsulant is formulated to provide smooth crowns over devices of wire bonds. Encapsulant provides protection from thermal and mechanical shock. Compound is stable at room temperature for up to three months, but is best kept stored at -40°C or colder, since filler may settle.

Dexter Electronic Materials Div., The Dexter Corp., A Div. Of Loctite Corp.
City Of Industry, CA 91746 1282
Nov 16, 2001 Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch applications having gaps as small as 25 microns.

Tra-Con, Inc.
Bedford, MA 01730
Nov 08, 2001 TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.

Tra-Con, Inc.
Bedford, MA 01730
Nov 08, 2001 TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

Electronic Materials, Inc.
Breckenridge, CO 80424 8817
Nov 08, 2001 CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of stable environment through broad range of thermal excursions.

Fiber Optic Center, Inc.
New Bedford, MA 02740 6322
Nov 01, 2001 AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and multifiber connectors, it also suits single mode and other connectors.