Molding Compound suits harsh under-the-hood applications.
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Press Release Summary:
Hysol® GR725-AG non-antimony/non-bromine/non-phosphorous semiconductor molding compound is suited for automotive applications. It replaces epoxy molding compounds containing brominated flame retardants and antimony trioxide, which can degrade gold wire/aluminum pad interconnects at elevated temperatures. Compound incorporates transition metal oxides and is suitable for use in Power SO packages with continuous-use temperatures up to 200°C.
Original Press Release:
Henkel Technologies Develops Molding Compound for Harsh, Under the Hood Applications
Hysol® GR725-AG Green Semiconductor Material For High Temperature Automotive Applications Makes Market Debut
Henkel Technologies today announced the development and market availability of Hysol® GR725-AG, a high-temperature semiconductor molding compound ideally suited for underhood automotive applications and capable of withstanding harsh environmental conditions. This material replaces epoxy molding compounds containing brominated flame retardants and antimony trioxide, which can degrade the gold wire/aluminum pad interconnects at elevated temperatures, causing increased resistance and reliability issues.
Hysol® GR 725-AG is specifically designed for High Temperature SO packages and Surface Mount Discrete packages operating at high temperatures where good electrical stability is required. The advanced material incorporates transition metal oxides (US Patent Number 6,432,540) that deliver the best high temperature performance when compared with competitive products using a High Temperature Operation Life resistance test. Currently, Hysol® GR725-AG is being used in Power SO packages with continuous-use temperatures up to 200°C.
This unique molding compound has been shown to meet JEDEC Level 1, 260°C reflow profile precondition requirements and incorporates patented green (non-antimony/non-bromine/non-phosphorous) flame retardant technology. With excellent molding characteristics, superior adhesion to nickel palladium gold (Ni/Pd/Au) and copper silver (Cu/Ag) lead frames and high productivity properties, Hysol® GR725-AG is the ideal material for today's most demanding high temperature semiconductor applications.
For more information on Hysol® GR725-AG call 1-716-372-6300 or e-mail Henkel Technologies at electronics@loctite.com.
Company Contact
Lisa Stickley
Henkel Technologies
P: 626-968-6511, x 414
E: lisa.stickley@loctite.com
About Henkel
"Henkel - A Brand like a Friend". With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. The business sector Henkel Technologies is one of the leading suppliers of adhesives, sealants and surface treatments for industrial customers. Strong brands, such as Loctite, Teroson, P3, Hysol and Liofol, are key drivers behind the success of the business sector. Henkel Technologies serves the automotive, electronics, aerospace, metal industries, assembly, maintenance and repair, consumer goods and packaging industries.
The Henkel Group operates in three strategic business areas - Home Care, Personal Care, and Adhesives, Sealants and Surface Treatment. In fiscal 2003 the Henkel Group generated sales of 9.436 billion Euro and an operating profit (EBIT) of 706 million euros. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel.
