Materials

WLAN Module performs in harsh industrial environments.

WLAN Module performs in harsh industrial environments.

Designed for 3U Compact PCI systems, Model F209L wireless LAN module operates in -40 to 85Â-ºC industrial temperature range and can be coated with conformal film to protect against humidity and dust. Product supports IEEE 802.11b wireless data transfers up to 11 Mbps, has output power range of 20 dBm, and has outdoor signal range of up to 600 m. Module, based on the Prism 2.5 chipset,...

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Electrical Mount eliminates floating device installations.

Electrical Mount eliminates floating device installations.

Designed to mount devices flush in oversized drywall, tile, and panel wall applications, Shim-lock fastens onto screw in mounting slot of electrical wiring device or lighting control strap. Once screw is tightened to desired depth, Shim-lock's tabs lock it in place. Made of steel with heat-treated finish and clear zinc chromate plating, product is 0.31 in. in length with #6 screw opening and...

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Non-Tacky Pre-Preg Materials optimize molding throughput.

Non-Tacky Pre-Preg Materials optimize molding throughput.

Non-adhesive pre-preg thermoset composites (b-stage products) are dry to touch and can be customized to fit range of end-user requirements. Products do not require release film, enhancing storage, handling, and processing rates. Tight resin/substrate ratios ensure consisent reactivity. Available substrates include glass, cotton, paper, carbon fiber, and customer-specific substrates, while choice...

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MIPS Technologies Unveils New SOC-it-® Platform Strategy for MIPS-Based(TM) SoCs

MIPS-Verified(TM) Platform to Simplify Design of High-Performance SoCs and Accelerate Time-to-Market FALL PROCESSOR FORUM, SAN JOSE, Calif., Oct. 10 / With time-to-market pressures mounting for complex 90nm and 65nm SoC designs, MIPS Technologies, Inc. (NASDAQ:MIPS) today unveiled a new platform strategy for its entire range of MIPSÂ-® processors. The fully verified SOC-itÂ-® Platform and...

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Option Achieves Industry's First HSUPA Calls Using Next Generation Wireless Data Card

Option HSUPA Data Card - QUALCOMM Chipset- Nortel Infrastructure LEUVEN, Belgium, October 11// -- Option (Euronext: OPTI, OTC: OPNVY), the wireless technology company, today announced that they have successfully completed the industry's first demonstration of live HSUPA (High Speed Uplink Packet Access) data card calls reaching a wireless uplink transmission rate of 1.3 Mbps and a wireless...

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Conductive Polymers Provide Alternative to Metal Components for Telecommunications Applications

Conductive Polymers Provide Alternative to Metal Components for Telecommunications Applications

-- UL 94 V0 parts molded by Fielding Manufacturing meet FCC requirements for EMI shielding and chemical resistance requirements of Telecordia, NEBS, and ETS Cranston, RI -- Enclosure front panels and related components molded from a new conductive polymer have sparked the interest of major telecom equipment suppliers as replacements for more traditional metal counterparts in circuit board...

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Soft Processor boosts performance of 65 nm Virtex-5 FPGAs.

Operating at 210 MHz, MicroBlaze(TM) 5.00 32-bit RISC core delivers 240 DMIPS in Virtex(TM)-5 FPGAs and extends floating point performance to 50 MFLOPS. It includes configurable cache line size options of 4 or 8 words, instructions that are useful with data-intensive multimedia applications, and Processor Version Register that enables multi-processing applications. Processor's user selectable...

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Altera Nios II Embedded Processor Receives Electronic Engineering & Product World Award

San Jose, Calif., Oct. 24, 2006-Altera Corporation (NASDAQ: ALTR) announced today that its NiosÂ-® II family of embedded processors received the Electronic Engineering & Product World (EEPW) 2006 Editors' Choice Award for China's Best Embedded System Technology. The Nios II family was one of ten winners selected in a three-step voting process that included an online readers' survey and...

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UFP Technologies Provides Biodegradable Packaging for Pangea Organics Bar Soaps

UFP Technologies Provides Biodegradable Packaging for Pangea Organics Bar Soaps

UFP Technologies Inc., (NASDAQ - UFPT), a leading manufacturer of custom engineered packaging materials, is providing Pangea Organics Ecocentric Bodycare, a leading organic personal care product manufacturer, with a biodegradable and recyclable clamshell for its line of bar soaps. Molded Fiber, a division of UFP Technologies, manufactures the customized shells, which are made from 100% recycled...

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Xilinx Strengthens Automotive Offering with Industry's Only Complete Programmable MOST-® Solution

Highly Integrated FPGA-Based MOST Network Interface Controller Solution Enables Flexible System Partitioning for Infotainment Applications SAN JOSE, Calif., Oct. 9 // -- Xilinx, Inc. (NASDAQ:XLNX) today announced its programmable solutions roadmap based on the Media Oriented System Transport (MOST) networking protocol for automotive electronics. Based on its market-leading programmable logic...

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Vector® Sports Training Ball Offers Visible Point of Contact
Sponsored

Vector® Sports Training Ball Offers Visible Point of Contact

Our goal is to help every athlete derive maximum enjoyment from their sport and become a better player. We offer a line of innovative training tools that combine cutting-edge technology and out of the box thinking to deliver an unbeatable competitive advantage. The Vector® Sports Training Ball is just another example of our commitment to innovation. To learn how the Vector® is helping ballplayers everywhere, see our video.

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