Hot Melt Encapsulant offers thermal conductivity.
With ability to transfer heat through encapsulating layer, Thermally Conductive Technomelt® offers dual-function performance in single material solution. Product can be melted, molded, and cooled under low pressure, delivering encapsulation technique that protects delicate circuitry and PCB assemblies, while forming self-enclosed housing and enabling heat dissipation. Offering thermal...
Read More »Removable Hot Melt Material streamlines substrate coating.
Formulated to allow accelerated, precise deposition in small areas, slump-resistant Technomelt® AS 8998 is compatible with automated dispensing systems and offers peel-off approach to masking specific components or designated PCB areas that must remain free of any applied protective coatings. This silicone- and halogen-free, RoHS-compliant material, which solidifies upon cooling, ensures...
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3D Printing Resins come in standard and rubber-like formulations.
Supplied in 12.35 oz bottles, ImageCure™ PRH35-ST2 and PRR35-OP are resins intended for use with monoFab™ ARM-10 3D printer. PRH35-ST2, formulated for minimal odor emission in liquid form, allows accelerated printing and facilitated filing/sanding of finished models. Formulated to stretch and compresses like rubber upon curing, PRR35-OP can be used to produce diverse variety of parts and...
Read More »Transition Networks to Demo Power Fiber Extender for Long Distance Power-over-Ethernet
Company Working with SENKO Who Will Display Solution at OFC 2016 Minneapolis, MNÂ- – Transition Networks, Inc., the data network integration technology expert, today announced it will display its prototype Power Fiber Extender solution at the OFC Conference on March 20 - 24 in Anaheim, California. The new solution leverages a hybrid fiber copper cable, using the SENKO IP-ONE®...
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Improving Energy Security at Commercial and Industrial Faculties with Solar, Energy Storage, and Microgrids
Check out this white paper to learn how onsite power generation can prevent your company from experiencing costly outages.
Read More »Lead Paint Sealant/Treatment is formulated for safety, efficacy.
AppliedÂ- via paint sprayer, brush, or roller, Lead Defender® is formulated with lead treatment reagents made with food-grade additives for natural binding properties. Blend provides human bioavailability reduction in case of accidental ingestion of treated lead paint dust/chips. Adhesion reduces prep time and supports application on diverse surface types. Integrated technology seals...
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Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA
Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The NetherlandsÂ- – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson...
Read More »ETFE Adhesive chemically bonds to engineered plastics.
Able to bond to dissimilar materials, such as polyamides, polyethylenes, and metals, Fluon® ETFE LH-8000 is suited for producing multilayer structures in one-step process without surface treatment. Chemical-resistant product has ultra-low melting point of 180–190°C, and offers wide processing temperature range between melting point and onset of degradation (350°C). Typical...
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Dymax SpeedMask® Masking Resins to be Showcased at MRO Americas
Torrington, Connecticut – Dymax Corporation will showcase SpeedMask® line of masking resins in Booth #4211 at MRO Americas, scheduled to take place April 5-7, 2016 at the Kay Bailey Hutchison Convention Center in Dallas, Texas.Â- SpeedMask products replace tapes, waxes, lacquers and fixtures while offering reliable protection against most metal-finishing process environments....
Read More »Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which...
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Silicone-Free Tapes target aerospace composite industry.
Suited for low out-gassing applications requiring EMS 595, High Temperature Silicon-Free Adhesive Tapes include DW915-1 and DW915-2 polyester tapes for composite Lay-up; DW716-2HD PTFE tape for use as composite tool coat; DW379 printable glass tape for aerospace blanket seaming; and DW417 consisting of flexible dead soft foil supplied on release liner, suitable as heat shield tape. All are...
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Krueger Sentry Gauge Announces the Release of Two New Chemical Sight Gauge Models Designed for Aggressive Liquid Storage Monitoring
Krueger Sentry Gauge, a leader in chemical sight gauges, now offers the ultimate in aggressive liquid storage monitoring devices. From sulfuric and hydrochloric acid to bleach, and acetone, our products are designed with robust features that deliver a long and trouble-free service life. See our video to learn all about this new and innovative line of sight gauges.
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