Controls and Controllers

Motion Control Solutions for Tube Mills and Rollformers.

UCG builds new control systems, die accelerators, drives and other accessories to retrofit new or existing machinery in almost any industrial environment. We have the knowledge to offer you a complete turn-key system from the initial design to start-up. Located under one roof with a leading used machinery dealer, Universal Tube & Rollform Equipment Corporation, our unique relationship enables us...

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Controls and Controllers

Motion Control Solutions for Tube Mills and Rollformers.

UCG builds new control systems, die accelerators, drives and other accessories to retrofit new or existing machinery in almost any industrial environment. We have the knowledge to offer you a complete turn-key system from the initial design to start-up. Located under one roof with a leading used machinery dealer, Universal Tube & Rollform Equipment Corporation, our unique relationship enables us...

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Master Bond EP3HTSDA-1 for Die Attach Applications
Epoxies

Master Bond EP3HTSDA-1 for Die Attach Applications

Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing. Watch Video on EP3HTSDA-1: http://click.skem1.com/click/koc3k-cbupji-13mg5467/ Updated Electronic...

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Master Bond EP3HTSDA-1 for Die Attach Applications
Epoxies

Master Bond EP3HTSDA-1 for Die Attach Applications

Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing. Watch Video on EP3HTSDA-1: http://click.skem1.com/click/koc3k-cbupji-13mg5467/ Updated Electronic...

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How to Choose the Right Adhesive Tape for Your Application
Sponsored

How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

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Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Epoxies

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically”...

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Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Epoxies

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically”...

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Encapsulants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Encapsulants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Applications in Research Labs and Commercial Use for EP29LPSP
Epoxies

Applications in Research Labs and Commercial Use for EP29LPSP

Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. In over a dozen published research articles, patents, and manufacturers’ specifications, scientists and engineers have identified EP29LPSP for use in...

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Applications in Research Labs and Commercial Use for EP29LPSP
Epoxies

Applications in Research Labs and Commercial Use for EP29LPSP

Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. In over a dozen published research articles, patents, and manufacturers’ specifications, scientists and engineers have identified EP29LPSP for use in...

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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)
Sponsored

Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)

Fiber Reinforced Polymers (FRP), represents a truly groundbreaking advancement in structural reinforcement. Lightweight, strong, and green, they are changing the way the construction industry thinks about rebar. Unlike steel, FRPs don't rust and are far stronger than standard rebar. To learn why Fiber Reinforced Polymers are poised to change the way the world builds, see our video.

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