Press Release Summary:
Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound exhibits electrical insulation properties and resistance to water.
Original Press Release:
New Flexible, Low Viscosity Potting Compound
HACKENSACK, NJ - Feb 4, 2008 -- A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.
Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.
Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.