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Silicone Rubber Sealants suit high-volume manufacturing.
LoctiteÃ-® 5210 and LoctiteÃ-® 5211 non-corrosive sealants are used for wire tacking, selective sealing, vibration dampening, and repair/rework applications on PCBs. Thixotropic, moisture curing LoctiteÃ-® 5210 lets product conform to applied components while remaining where dispensed. Medium viscosity LoctiteÃ-® 5211 allows material to flow into applied areas and encapsulates...
Read More »Molding Compounds are suited for hearing aid fabrication.
Available in 14 low-viscosity and 8 high-viscosity verisons, LoctiteÃ-® ResinAid molding compounds are offered in various colors to closely match natural skin tones. Compounds comply with ISO-10993 standards for skin surface medical devices. Line also includes 9 adhesive formulations for bonding shell components. Batch curing chamber, LoctiteÃ-® ResinAid Shell Curing System, light cures...
Read More »Module Sealant suits automotive electronics assembly.
Medium-viscosity, UV- and moisture-curing LoctiteÃ-® 5252 is designed for post-assembly use on electronic module enclosures. Based on polyether rubber technology, thixotropic sealant withstands temperatures from -40 to +125Ã-
Read More »Dispensing System handles adhesives of varying viscosity.
LoctiteÃ-® Analog Syringe Dispenser consists of pressure-time-vacuum system for 10, 30, 55, and 300 ml syringe packages. Unit can be operated in manual or automatic timed dispense mode to dispense dots or beads, or fill syringes. Features include 0-100 psi adjustable pressure regulator, 4 selectable timer ranges, vacuum suck-back, momentary or timed dispense cycles, and illuminated function...
Read More »Semiconductor Packaging Material meets industry standards.
HysolÃ-® GR828 green molding compound is designed for SO packages with nickel palladium gold or copper silver spot lead frames that require JEDEC Level 1, 260Ã-
Read More »Thermal Interface Material requires no heating.
Reworkable LoctiteÃ-® PowerstrateXtreme(TM), suited for use between heat sink and heat dissipating components, is supplied as free-standing film between 2 release liners. Compound flows at phase change temperature and conforms to surface features of heat sink and component. Upon flow, air is expelled from interface, thermal impedance is reduced, and product performs as thermal transfer...
Read More »Molding Compound suits harsh under-the-hood applications.
HysolÃ-® GR725-AG non-antimony/non-bromine/non-phosphorous semiconductor molding compound is suited for automotive applications. It replaces epoxy molding compounds containing brominated flame retardants and antimony trioxide, which can degrade gold wire/aluminum pad interconnects at elevated temperatures. Compound incorporates transition metal oxides and is suitable for use in Power SO...
Read More »LED Light Source cures adhesives in seconds.
Able to cure various UV- and visible light-cure adhesives in seconds, hand-held LoctiteÃ-® 7700(TM) offers typical output of 500 mW/cmÃ-² at wavelength of 405 nm. Portable curing system measures 9 x 1 x Ã-¾ in. and weighs less than 0.5 lb. Suited for applications in crowded or hard-to-reach areas, unit may be powered via rechargeable batteries or ac adapter. LED technology allows...
Read More »Epoxy Mold Compound suits SIP applications.
HysolÃ-® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Ã-
Read More »Light-Cure Adhesives produce tack-free surfaces.
Loctite 3944(TM) single-component, medium-viscosity, light-cure, acrylic adhesive bonds plastic substrates that require tough, flexible bond. Fluorescent, low-odor product obtains tack-free surface in under 30 sec using low-intensity metal halide light source. Loctite 3526(TM) single-component, acrylic adhesive cures when exposed to UV/visible light or heat to form tough, flexible bond. Colorless...
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