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Spray Valve/Controller targets low viscosity applications.
Suited for liquids up to 1,200 cP, Spray Valve 98520 features single-acting on/off actuation and cycle rate up to 600 cycles/min. Short stroke needle, with 0.046 in. nozzle diameter, delivers consistent, round full cone spray pattern, while positive shut-off eliminates dripping. Spray Valve Controller 98521 provides pressure control, on/off timing, and atomized air supply. Applications include...
Read More »Molding Solution aids in automotive sensor manufacturing.
Suited for packaging of vehicle sensors, MacromeltÃ-® low-pressure molding solution is composed of polyamide hotmelt and available in various formulations. Material and process solution simultaneously encapsulates sensor's circuitry and forms outer shell of component to enable self-contained, integrated component. Available in translucent amber or black, product is resistant to fluids found...
Read More »Solder Powder/Flux allows soldering irons to be re-tinned.
MulticoreÃ-® TTC-LF consists of lead-free grade solder powder and flux, formed into shape of thick disk for cleaning and de-wetting soldering irons. Users wipe tip of iron across surface of TTC-LF to produce local melting, and then wipe on damp sponge. Suited for lead and lead-free applications, product features activators that thermally decompose into inert components, and ability to clean...
Read More »Liquid Fluxes target consumer electronics applications.
MulticoreÃ-® MF101 and MF300 are VOC-free, no-clean liquid fluxes suited for low solderability surfaces such as oxidized copper. They minimize or eliminate solder balling and are non-flammable. To complement lead-free wave soldering applications, MF200 helps eliminate micro solder balling, leaves minimal residue, and offers maximum process window. No-clean, sustained activity flux, MFR301 is...
Read More »Conductive Adhesive suits die attach applications.
Electrically conductive LoctiteÃ-® QMI529HT addresses requirements of higher-temperature processes such as lead-free manufacturing. Suited for attachment of ICs and components to metallic lead frames, silver-filled adhesive offers hydrophobic properties and temperature stability for production of void-free bond lines. Bismaleimide formulation can be SkipCured(TM) on diebonder or wirebonder...
Read More »Dispensers pump fluids/pastes from 5 to 55 gal containers.
Pneumatic LoctiteÃ-® Low Viscosity Fluid Pumps deliver various output volumes determined by pump ratio and input pressure. Carbon-steel system with Viton seals suits lubricants, epoxies, and urethanes, while inert metal system with EPR seals suits anaerobics, acrylics, epoxy hardeners, and water-based products. LoctiteÃ-® High Viscosity Paste Pump Systems consist of air motor, pump tube,...
Read More »Threadlockers come in liquid and stick form.
Color-coded for identification, Threadlockers come in medium and high strength formulas, as well as penetrating version. Products positively lock and seal threaded fasteners against vibration loosening and protect threads against corrosion, eliminating need for lock nuts and washers. Specified by automotive OEMs for use on assembly lines, adhesives are suited for applications ranging from...
Read More »Meter Mix Dispense Systems work with 2-part adhesives.
LoctiteÃ-® systems feature fixed and variable ratio units that can be customized with accessories to meet specific requirements. Featuring 2 positive displacement piston pumps, Loctite 1000 is designed for hand-held dispensing up to 10 ft away. Compact Loctite 2000 adds control panel and is capable of controlled shot size dispensing and pressure regulation. Loctite 3000 features PLC...
Read More »Instant Adhesive has precision flow control applicator.
LoctiteÃ-® QuickTiteÃ-® Super Glue incorporates clog-free, squeeze grip applicator that provides pinpoint control of amount and placement of adhesive. Available in no-run liquid and gel formulations, instant adhesive works with materials such as rubber, metal, plastic, glass, and vinyl. Offered in 0.14 oz bottles, it can be used on vertical and nonporous surfaces and is also effective on...
Read More »Lead-Free Solder Paste suits high-speed printing processes.
Available in lead-free alloys 96SC and 97SC, water-washable Multicore WS300 is resistant to humidity and slump, and is formulated to minimize any defects due to voiding. Paste is classified as ORH1 and meets or exceeds test specifications of ANSI/J-STD-004 and 005 for SIR, corrosion, fluorides, and slump. Product also meets Bellcore GR-78-CORE tests for electromigration and SIR.
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