Share:
Surface Mount Adhesives optimize assembly processes.
LoctiteÃ-® ChipbondersÃ-® 3609, 3616, 3621, 3627, and 3629 address elevated temperatures of lead-free soldering processes. Loctite 3609 is suited for general-purpose high-speed dispensing, while Loctite 3616 handles high-speed printing, and Loctite 3621 targets dispense jetting. Suited for dispensing and ProFlow printing, Loctite 3629 cures at 120Ã-
Read More »Lead-Free IC Package offers green-certified solution.
Optimized for lead-free manufacturing, package integrates HysolÃ-® GR828H mold compound with Hysol QM1519 die attach adhesive for wire sweep properties and adhesive strength, respectively. Green solution, designed for 16- and 14-lead, Pb-free SOIC packages, uses Cu/Ni/Au leadframe. It achieves MRT reliability for MSL L1 up to 260Ã-
Read More »Dam and Fill Encapsulants meet lead-free requirements.
HysolÃ-® FP4451TD(TM) and FP4800(TM) meet stringent JEDEC level testing requirements and enable wirebonded cavity-down SuperBGAÃ-® and Viper(TM) BGA packages. Suited for package level applications, Hysol FP4451TD offers aspect ratio of 0.70 height-to-width and enables dam heights greater than 1 mm. Self-leveling, liquid encapsulant, Hysol FP4800 withstands solder temperatures to 260Ã-
Read More »Dispenser offers manual and semi-automatic work modes.
Electromechanically operated LoctiteÃ-® Benchtop Peristaltic Dispenser uses pressure from mechanical rotor to move single-component adhesives or solvents with viscosities up to 5,000 cPs. Able to transfer adhesives directly from bottle to handheld dispense valve, volumetric dispense system suits applications that require dot to dot or continuous bead repeatability. System uses air-free...
Read More »Molding Compound targets hearing aid applications.
LoctiteÃ-® ResinAidÃ-® 3596 produces tear-resistant, conformable shells that deliver comfort in ear canal and comply with ISO-10993 standards for skin surface medical devices. Formulation withstands jaw movement and resists chemicals found naturally in human ear. With viscosity of 1,000 cp, product cures on exposure to UV or visible light of correct intensity, and provides post-cure tear...
Read More »Adhesive combines epoxy and light cure chemistries.
LoctiteÃ-® 3355(TM) works on colored and opaque substrates such as metals, plastics, glass, and ceramics that cannot transmit light. Once dispensed onto opaque part, exposure to UV light at 254-365 nm for 5-60 sec activates adhesive, which cures to fixture strength in minutes and reaches full cure in hours at room temperature. Single component, medium viscosity product requires no mixing,...
Read More »UV Wand System delivers surface cure to adhesives.
Designed to provide rapid tack-free cure cycles, LoctiteÃ-® ZETAÃ-® 7760 is equipped with 200 W HPMA lamp that outputs up to 20 W/cmÃ-² of UV light at 250-410 nm. Single light source can power up to 4 separate cure areas. Intended for spot curing applications, system performs best on cure areas up to Ã-½ in. in diameter. It can be operated manually or using timed shutter light...
Read More »Instant Adhesive Gel comes in spill-proof bottle.
General-purpose LoctiteÃ-® QuickTiteÃ-® is packaged in self-piercing, spill-proof bottle that will not leak into pocket or toolbox. No-clog tip allows user to dispense gel from first drop to last without waste, while bottle's locking collar prevents adhesive from leaking or hardening. Squeeze-grip applicator dispenses exact amount of adhesive into precise location desired. Product is...
Read More »Silicones suit deep potting and sealing applications.
One-part LoctiteÃ-® Nuva-SilÃ-® Silicones cure tack-free in seconds to depth of 2 in. upon exposure to UV or high-power visible light. Translucent in appearance, products offer weather, temperature, and moisture resistance, and will not degrade or yellow on long-term exposure to light. All offer built-in fluorescence detection system that allows automatic quality inspection. These...
Read More »Die Attach Material bonds same size die stack packages.
HysolÃ-® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric...
Read More »