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No-Clean Flux is compatible with all solder alloys.
Designed for surfaces with poor solderability, MulticoreÃ-® MF210 is resin-free and halide-free. Sustained activity flux works over range of solder resists and is compatible with rosin and OSP-based surface preservatives. Material allows for high-speed soldering on conventional leaded and surface-mount components and offers good through hole penetration. No-clean characteristic ensures...
Read More »Dispensing System applies light-cure acrylics to tubing.
Designed for one-handed operation, LoctiteÃ-® Light Cure Adhesive Dispensing System for Tubing consistently applies uniform coating in user-specified amount. Design prevents light exposure during dispense process and accommodates adhesives with viscosities up to 1,500 cp and parts with 2.0-6.0 mm OD. Features include interchangeable stainless steel bushings, sight glass, and electric motor...
Read More »Semi-Solid Anaerobic Stick Products will not leak or drip.
QuickStix(TM) 534(TM) Hi-Tack Gasket Dressing allows cut gaskets to be positioned and held in place while mating surfaces are aligned for assembly. Product cures at room temperature. Oil resistant QuickStix(TM) 548(TM) Gasket EliminatorÃ-® Flange Sealant prevents fluid or gas leaks on rigid iron, steel, and aluminum flanges. QuickStix(TM) 668(TM) Retaining Compound bonds non-threaded...
Read More »Lead-Free Solder Paste exhibits humidity resistance.
MulticoreÃ-® LF318 is a halide-free, no-clean, pin-testable formulation that offers broad process windows for printing and reflow. Offering open time greater than 24 hr, paste provides initial tack force of 2.0 g/mmÃ-². It achieves high degree of coalescence upon reflow, even after 72 hr at 27Ã-
Read More »UV-Cure Encapsulants cure within 26-46 sec.
Hysol 3323, 3327, and 3329 are dam-and-fill products for encapsulation of wire-bonded dies used in Smart Card ICs. Used to form dam, high-viscosity Hysol 3323 has thixotropic nature and glass transition temperature (Tg) of 155Ã-
Read More »Epoxy Adhesive targets consumer electronics companies.
LoctiteÃ-® 3629 features low temperature cure, making it suited for applications where heat sensitive materials must be bonded prior to wave soldering. Successfully tested in lead-free production environments, surface mount product also meets standards of on-board reliability testing such as SIR testing. Available in syringes and cassettes, uncured adhesive is fluorescent under UV light, and...
Read More »Solder Paste resists effects of humidity.
Suited for various process conditions, MulticoreÃ-® MP218 is pin-testable and has halide-free, no-clean formulation. Slump-resistant product is available in Sn62, Sn63, and 63S4 alloys and is suitable for reflow in air or nitrogen. With open time exceeding 24 hr, paste has 1.6 g/mmÃ-² initial tack force rating, which makes it resistant to component movement during high-speed placement....
Read More »Dispense Needle Kit contains 115 tips.
Dispense Needle Kit includes dispense tips in variety of styles, lengths, and gauge sizes for syringe and automated valve-type adhesive dispensing. All feature threaded hubs to facilitate locking. In addition to stainless steel and taper tips, flexible polypropylene tips, and 45Ã-
Read More »Cyanoacrylate Adhesive resists humidity and temperature.
Surface insensitive LoctiteÃ-® PrismÃ-® 4500 Series cure speeds will not degenerate measurably over 21 month shelf life. LoctiteÃ-® PrismÃ-® 4500(TM) gel will not flow on vertical applications, while wicking viscosity Loctite Prism 4501(TM) flows into hard-to-reach areas. Loctite Prism 4502(TM) and 4503(TM) are low- and medium-viscosity cyanoacrylates, respectively, formulated for...
Read More »Light Curing System facilitates hearing aid fabrication.
ResinAid self-contained UV/visible light cure oven produces hearing aid shells using Loctite ResinAid molding compounds. System has 18 x 43 x 27 in. chamber, fully shielded and interlocked to ensure safe operation. Air cooling prevents devices from overheating, and reflector design provides uniform light distribution. Top-loading 8 x 8 in. curing chamber irradiates multiple assemblies...
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