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Acheson Colloids Introduces Low-VOC, Corrosion-Resistant Dry Film Lubricant
PORT HURON, Mich., July 11, 2006 Acheson Colloids Company has introduced Emralon® TM-008, a new water-based, low-VOC, dry film lubricant coating that provides a low coefficient of friction along with corrosion and solvent resistance in permanent lubrication applications. Emralon TM-008 waterborne fluoropolymer lubricant and anti-corrosion coating can be applied by spray or the dip-spin process,...
Read More »Introducing an Alternative to ITO Sputtered Film
Acheson Colloids Company is proud to offer Electrodag® PF-427 transparent conductive inks as a low-cost alternative to Indium Tin Oxide (ITO) sputtered film. This product is compatible with Acheson's Electrodag silver and dielectric inks for a fully additive and complete ink package. ITO sputtered film is costly and unpredictable. The sputtered layer is adversely affected with each annealing,...
Read More »Acheson Colloids Markets Cerflon-® Technology
[Port Huron, Michigan] Acheson Colloids Company has introduced three new, high quality specialty lubricants utilizing the patented CERFLON® ceramic reinforced fluoropolymer technology. Acheson Colloids is the licensed manufacturer of CERFLON® colloidal dispersions. The three new specialty lubricant products are: o SLA 2010 (CERFLON®) Colloidal PTFE and Boron Nitride in Oil o SLA 2020...
Read More »New Conductive Coatings from Acheson Improve Lithium-Ion Batteries and Hydrogen Fuel Cells
PORT HURON, Mich., Aug. 1, 2006 Acheson (www.achesonindustries.com) has introduced Dag® EB-023 and Dag EB-030, advanced new coatings for lithium-ion batteries. These new products provide highly conductive, tough, tenacious, chemical- and solvent-resistant coatings that withstand the environment inside polymer lithium-ion batteries. The coatings, which are one-component, solvent-based dispersions...
Read More »Acheson Food Grade Lubricant Additives Works Where Others Fail
When you need industrial-strength lubrication in a food processing environment, there's only one choice - Acheson FGA(TM) Food Grade Lubricant Additives. As temperatures soar, particularly in high-throughput baking operations, most traditional lubricant additives break down. Not so with Acheson FGA Series. Composed of concentrated dispersions such as Boron Nitride in synthetic fluid carriers,...
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Henkel to Present Latest Research and Show Current Materials Innovations at Upcoming ATExpo Event
Irvine, California, September 7, 2006- With several new products on display and leading technical staff set to present four papers on the company's latest ground-breaking materials research, Henkel is poised to be one of the main attractions at the upcoming Assembly Technology Expo (ATExpo), scheduled to take place September 26-28, 2006 in Rosemont, Illinois. Henkel Applications Engineering Team...
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Henkel Introduces Loctite-® Adhesive Line for Structural Metal Bonding
Rocky Hill, Conn. - June 22, 2006.... Henkel Corporation has introduced a new line of seven structural acrylic adhesives that deliver tough, durable bonds to a variety of metals. Two part Loctite' Speedbonder(TM) structural adhesives bond aluminum, steel, and galvanized metals to a variety of substrates including plastics and composites, and dramatically reduce the need for mechanical fasteners....
Read More »New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages
Irvine, California, August 8, 2006 New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices. Uniting the robust performance characteristics of die attach...
Read More »Compound suits thin and ultra-thin SMD applications.
HysolÃ-® QMI529LS die attach material combined with HysolÃ-® GR828A mold compound delivers properties necessary to provide material set for packages used in low-profile products such as cell phones and portable music players. Formulation of Hysol QMI529LS provides hydrophobic properties, while delivering stability at extremely high temperatures. Tested to JEDEC Level 1, 260Ã-
Read More »Adhesive Paste suits stacked die applications.
Designed to meet requirements of semiconductor firms, HysolÃ-® QMI536NB can be used on all levels of stacked die. Non-conductive, PTFE-filled paste exhibits low resin bleed and is lead-free compatible. After multiple exposures to 260Ã-
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