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Henkel Receives Top Honors for Innovative Lead-Free Solder Paste
Henkel's award-winning record continues with yet another industry accolade, which was bestowed upon the global materials leader at the recent Nepcon China exhibition in Shanghai, China, where the company's Multicore-® LF318 lead-free solder paste received the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials. Developed to appeal particularly to...
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Light Curing Wand suits industrial/medical applications.
Designed for use with Loctite 3552(TM) and 3553(TM) Visible Light Cure Adhesives, Loctite ZETA 7720 Visible Light Wand System provides safe, immediate cure for assembly applications. Its output, which exceeds 1.5 W/cmÃ-² of visible light irradiance, can cure bead sizes as large as Ã-¾ in. dia. Featuring fiber optic light guide and 100 W visible arc bulb, product requires no venting or...
Read More »Waveform Analyzer detects defects in dispense processes.
Using membrane sensors, LoctiteÃ-® Fluid Waveform Analyzer C (LFWA-C) Series offers standardized application process for monitoring sealant and adhesive dispenses for variability. Rotospray mode monitors up to 4 short simultaneous dispenses, while single bead dispense analysis mode monitors single dispense operations. With modifiable parameters, processes can be refined to prevent production...
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Visible Light Cure Adhesives Achieve ISO 10993 Biocompatibility
Rocky Hill, Conn. - March 16, 2006.... The Loctite' Visible Light Cure adhesive line from Henkel Corporation has recently been granted ISO 10993 biocompatibility compliance after passing a rigorous series of biological tests. Loctite Visible Light Cure adhesives rely solely upon the visible light spectrum to deliver safe, efficient, immediate cure for a broad array of medical device assembly...
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Revolutionary Thermally Conductive Adhesive from Henkel Selected for APEX's Innovative Technology Showcase
Long recognized as an industry leader in materials development and formulation, the electronics group of Henkel was again awarded with top honors for yet another innovative material solution. At the recent APEX show in Anaheim, California, Henkel's Loctite-® 3876 was chosen to be part of show organizer IPC's (Association Connecting Electronics Industries) Innovative Technology Showcase. As...
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LED Light Source emits no UV wavelengths.
LoctiteÃ-® 7703 Hand-held LED Light Source delivers immediate cure of LoctiteÃ-® 3552(TM) and 3553(TM) Visible Light Cure Adhesives. It provides output up to 2.0 W/cmÃ-² of visible light irradiance, and measures 9 x 1 x Ã-¾ in. High-powered, portable system features LED point light source with extended tip that cures adhesive joints up to Ã-¼ in. square. It can use...
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Low-Voiding Solder Paste suits fine-pitch applications.
Designed for high-volume stencil printing applications with CSP lead pitches of 0.5 and 0.4 mm, MulticoreÃ-® LF328 is formulated to deliver low voiding in BGA joints. It provides tack force sufficient to resist component movement during high-speed placement and enables print speeds with print pressure that minimizes board warpage. Classified as ROL0 to ANSI/J-STD-004, is halide-free, no-clean...
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High Flow Underfill cures rapidly at low temperature.
Formulated for use with CSP and BGA packages, LoctiteÃ-® 3549 underfill protects solder joints against shock, drop, and vibration. Material has been tested to JEDEC drop test standards on 0.4 and 0.5 mm lead-free devices. Compatible with lead-free solder materials, underfill is completely reworkable and features a pot life of 14 days at room temperature and 7 days at 40Ã-
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Thermally Conductive Adhesives have color-coded chemistry.
LoctiteÃ-® Bead-on-Bead products are used for bonding heat-dissipating electrical and electronic devices to heat sinks and spreaders. Mixing occurs only when 2 items to be bonded are joined together. With thermal conductivity of 1.75 W/mÃ-
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Structural Adhesive bonds galvanized surfaces.
Without requiring surface preparation, LoctiteÃ-® H8600(TM) Speedbonder(TM) cures when mixed at room temperature to bond galvanized steel, aluminum, stainless steel, polycarbonate, fiber reinforced plastic composite, and Gelcoat substrates. Non-sagging, 2-component, acrylic adhesive is 100% reactive and fills gaps as large as 0.375 in. Viscosity allows it to be applied horizontally or...
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