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Thermal Interface Materials suit heat sink assembly.
IsostrateÃ-® J-Series dielectric thermal interface materials provide low thermal impedance of .48Ã-
Read More »No-Clean Rosin Flux is solvent-based.
LoctiteÃ-® MulticoreÃ-® MFR301 sustained activity liquid flux, designed for wave soldering PCBs, is suited for dual wave processing. Rosin/solvent synergism ensures optimum drainage behavior at exit of wave, minimizing bridging, spiking, and mid-pad solder balling. Product leaves thin, protective coating of rosin on soldered PCBs and leaves them dry to touch with slight rosinous luster....
Read More »Anti-Seize Lubricants come in semi-solid stick form.
Anti-seize stick lubricants facilitate dispensing directly onto parts, will not leak or drip, and can be stored in pocket or toolbox. Loctite-® C5-A-® copper-based lubricant shields against seizing and galling in dry service temperatures of -20 to +1,800-°F. Loctite-® Silver Grade heavy-duty thread lubricant has smooth texture for protecting fine threads and closely mated parts. It lubricates...
Read More »Die Attach Adhesive is thermally conductive.
HysolÃ-® QMI 519HT02 silver-filled, die attach adhesive is formulated for use on die with high power densities. Hydrophobic and stable at temperatures to 260Ã-
Read More »Threadlocker Sticks simplify product assembly.
Semi-solid LoctiteÃ-® 248 and 268 offer performance characteristics of liquid threadlockers, yet will not leak or drip and can be easily transported and stored. Medium-strength Loctite 248 Blue is suited for threaded metal fasteners, especially those with diameters from Ã-¼ to Ã-¾ in. High-strength Loctite 268 Red is suited for applications where resistance to heavy shock, vibration,...
Read More »Liquid Flux reduces solder-balling defects.
High-activity, VOC-free MulticoreÃ-® MF300 is effective on low-solderability surfaces, such as oxidized copper. Non-flammable, halide-free, low-residue flux meets US air-quality legislation and is compatible with most commonly used preservative materials. It passes Bellcore electromigration and J-STD-004 surface insulation resistance tests without cleaning, and IPC-TM-650 copper mirror...
Read More »Air Filtration Systems remove dust particulate and fumes.
Benchtop systems, available with/without 2 x 24 in. flexible arm, operate as open plenum for working area to 12 in. wide. Units feature bi-colored LED light and deep bed activated carbon fume filter. Freestanding systems are offered in 115 V, 60 Hz; 230 V, 50 Hz; and explosion-proof models. They offer 14 x 18 in. filter, differential pressure gauge, multi-stage filtration, and deep bed, 20 lb...
Read More »Adhesive bonds non-active package surfaces.
HysolÃ-® QMI 550SI low-CTE, silica-filled, dielectric die attach adhesive is hydrophobic and produces void-free bond lines that adhere to organic and metal surfaces. Product allows SkipPrebake(TM) and can be cured in-line using SkipCure(TM) processing 10 sec after bond line reaches 150Ã-
Read More »Structural Acrylic Adhesive is non-sagging.
SPEEDBONDER(TM) H8000 delivers impact- and peel-resistant bonds on various surfaces including metals and composites. Product consists of 100% reactive, 2-component gel that cures at room temperature and bonds to materials with little or no surface preparation. Capable of filling gaps as large as 0.5 in., adhesive also offers environmental resistance. Product is packaged in 490 ml EPS cartridges,...
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Underfill Material is formulated for flip chip packaging.
HysolÃ-® FP4580 low stress liquid epoxy prevents cracking and delamination of chip's inner layers. It works on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4,000 solder bumps. When fully cured, product forms rigid, low warp seal that dissipates stress on solder joints and extends thermal cycling performance. HysolÃ-® FP4580 underfills devices with gaps as small as...
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