Press Release Summary:
IsostrateÂ® J-Series dielectric thermal interface materials provide low thermal impedance of .48Â°C-inÂ²/W, high cut-through resistance, and dielectric ratings of 4000 V/mil. Volumetric expansion at 60Â°C phase change temperature aids wetting action and eliminates voids and gaps due to mounting surface irregularities. Thixotropic properties prevent problems associated with migration and eliminate process issues associated with grease.
Original Press Release:
Dielectric Thermal Interface Materials for High Volume Cost-Efficient Heat Sink Assembly
Laguna Hills, Calif. --- November 26, 2003... Henkel Loctite Corporation has developed Loctite® Isostrate® J-Series dielectric thermal interface materials designed for use on non-isolated power semiconductors, MOSFETs, and rectifiers in packages such as TO-220, TO-247, TO-3, and TO-3P.
Loctite® Isostrate J-Series products provide extremely low contact thermal impedance, very high cut-through resistance, and excellent dielectric capability. An alternative to Mylar and thermal grease for a variety of heat dissipating components, Isostrate J-Series products deliver extremely low thermal impedance of .48°C-in2/W, and excellent dielectric ratings of 4000 V/mil. The product's volumetric expansion at the 60°C phase change temperature enhances wetting action and eliminates voids and gaps due to mounting surface irregularities.
The thixotropic properties of Loctite® Isostrate J-Series products prevent problems associated with migration and eliminate process hassles associated with grease. The extended wetting capability of these thermal films enables superior long-term thermal cycling.
For more information on Loctite® Isostrate® J Series products, call 949-582-6712, send an e-mail to email@example.com, or visit www.loctite.com/electronics.
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