Materials

Single-Pellet Compounds deliver enhanced effects.

LNP(TM) Verton(TM) Xtreme compounds - XC (extreme color), XFR (extreme flame retardance), and XW (extreme weatherability) - promote batch-to-batch consistency and help achieve optimal mechanical properties of long-glass-fiber reinforcement. Resistant to impact failure, compounds can be processed using standard and gas-assist injection molding, structural foam molding, and injection-compression...

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Kit aids development of networked embedded systems.

Intended for STR91x 32-bit microcontroller family based on ARM966EÂ-® core, STR9-comStick is configured as USB stick with built-in USB connector that enables it to plug into host PC. Included Hitex software tools allow developer to modify and recompile application source code, program STR91x MCU, and debug applications as they run on development system. Kit also includes sample applications,...

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Chips offer through-hole packaging option.

Electrically and thermally identical to SMT versions, VoI Chips with through-hole packaging are compatible with hand soldering and wave solder techniques. Through-hole assembly facilitates multi-chip, cold-plate or heatsink mounting, speeding system assembly. Packing option is available for all VoI Chips, including MIL-COTS versions.

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Mufflers provide noise reduction up to 35 dBA.

Available in 1/8-1 in. NPT sizes, Reclassifying Mufflers help companies meet EU noise directive (86/188/EEC) and OSHA standard 29 CFR-1910.95 for safe noise levels below 90 dBA. They can be installed directly into exhaust port of cylinders, valves, and other air powered equipment to reduce work area noise and harmful oil mist. Wrap design of removable element removes oil mist contamination of...

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Denali and LeCroy Demonstrate Industry-Leading PCIe 2.0 Solutions at PCI-SIG Developers' Conference

SAN JOSE, Calif., May 21 -- PCI-SIG Developers' Conference -- Denali Software, Inc., a world-leading provider of electronic design automation (EDA) software and intellectual property (IP), and LeCroy Corporation, a leading supplier of oscilloscopes and serial protocol analyzers, today announced the availability of a comprehensive solution, including PureSpec(TM) PCIe verification IP and...

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Subwoofer Signal Processor comes with PC GUI interface.

SonicMaster2(TM) delivers programmable platform for subwoofer signal conditioning that provides equalization, adjustable filters, and limiters, enabling protection from amplifier clipping and woofer bottoming for active subwoofer designs. Reconfigurable unit also enables addition of all analog AutoEQ processing. Product features 100% analog signal path for Pure Analog Sound, options for push...

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SerDes Core is compatible with various serial interconnects.

Based on 90 nm process technology, serializer/deserializer (SerDes) core is compatible with serial interconnects including PCI ExpressÂ-® (PCIe) 1.0 and 2.0, Serial ATA, SCSI, XAUI, and CEI. Operating from 1.2-6.4 Gbps, it allows users to capture receiving data waveforms dynamically on their system boards. Unit can also be used with wide range of packages including wire-bonded plastic ball...

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Solder Redefined
Sponsored

Solder Redefined

Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.

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