SerDes Core is compatible with various serial interconnects.

Press Release Summary:

Based on 90 nm process technology, serializer/deserializer (SerDes) core is compatible with serial interconnects including PCI Express® (PCIe) 1.0 and 2.0, Serial ATA, SCSI, XAUI, and CEI. Operating from 1.2-6.4 Gbps, it allows users to capture receiving data waveforms dynamically on their system boards. Unit can also be used with wide range of packages including wire-bonded plastic ball grid array (BGA) and flip-chip BGA (FCBGA).

Original Press Release:

NEC Electronics America Demonstrates New PCI Express 2.0-Compatible SerDes Core at PCI-SIG Developers Conference

SAN JOSE, Calif., May 21 / -- Continuing its dedication to offering cutting-edge communication and data transfer device technology, NEC Electronics today introduced a new serializer/deserializer (SerDes) core based on NEC Electronics' advanced 90-nanometer (nm) process technology. The core is compatible with a variety of high-performance serial interconnects, including PCI Express® (PCIe) 1.0 and 2.0, Serial ATA, SCSI, XAUI and the Optical Internetworking Forum's Common Electrical Interface (CEI). NEC Electronics America will demonstrate its support of these interfaces in booth #7 at the PCI-SIG Developers Conference, May 21-22, at the McEnery Convention Center in San Jose, California.

In addition to operating from 1.2 to 6.4 gigabits per second (Gbps), the new core has one of the lowest power consumption ratings and one of the smallest core sizes in the industry. Furthermore, unique built-in functionality allows users to capture receiving data waveforms dynamically on their system boards, minimizing the design risks typically associated with SerDes technology.

"As a leader committed to delivering innovative interface technologies, NEC Electronics has developed a SerDes core that can be used with a number of high-speed serial interfaces, including PCI Express 2.0," said Kats Nakazawa, general manager, digital consumer and connectivity strategic business unit, NEC Electronics America. "The core also can be used with a wide range of packages, including a wire-bonded plastic ball grid array (BGA) and a flip-chip BGA (FCBGA). The wire-bonded package enables designers to cut packaging costs significantly."


NEC Electronics America currently is accepting orders for the new core. For information, call 1 (800) 366-9782. More information about all of NEC Electronics' PCI Express products can be found at

About NEC Electronics America, Inc.

NEC Electronics America, Inc., headquartered in Santa Clara, California, is a wholly owned subsidiary of NEC Electronics Corporation , a leading provider of semiconductor products encompassing advanced technology solutions for the broadband and communications markets; system solutions for the mobile, PC, automotive and digital consumer markets; and multi-market solutions for a wide range of customer applications. NEC Electronics America offers local manufacturing in Roseville, California, and the global manufacturing capabilities of its parent company. In the Americas, NEC Electronics America markets and sells industrial-type, active-matrix LCD modules from NEC LCD Technologies, Ltd., a global leader in innovative display technologies. More information about the products offered by NEC Electronics America can be found at

Source: NEC Electronics America, Inc.

CONTACT: Denise Garibaldi of NEC Electronics America, Inc.,

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