Materials

Silicone Additive minimizes VOC emissions.

Added to polyurethane flexible foam used in furniture, bedding, and automotive parts, Niax L-590 minimizes volatiles that can impact environment. Based on non-hydrolyzable chemistry, product emulsifies chemicals during mixing, promotes formation of cells, and stabilizes foam during rise stage. It can stabilize range of formulations including hyper soft foams, high-density foams, and low-density...

Read More »

Synopsys DesignWare IP to Enable Next-Generation PCI Express 2.0 Products

Synopsys Is First to Deliver PCI Express Gen II Digital IP for Increased Bandwidth in Networking, Embedded and Computer Applications MOUNTAIN VIEW, Calif., Jan. 24 -- Synopsys, Inc. (NASDAQ:SNPS), a world leader in semiconductor design software, today announced that its portfolio of DesignWare(R) digital controller IP for PCI Express(TM) is the first to support the evolving 2.0 version (Gen II)...

Read More »
ERITECH-® Ground Enhancement Material Improves Grounding Effectiveness

ERITECH-® Ground Enhancement Material Improves Grounding Effectiveness

ERITECH-® Ground Enhancement Material (GEM) improves grounding effectiveness regardless of soil conditions and provides excellent permanent conductivity. GEM is ideal for areas with high resistance, such as rocky ground, mountain tops, extremely dry environments, and sandy soils. GEM is extremely effective, typically lowering the resistance of the grounding system by 40%. GEM contains cement. As...

Read More »

ZEVEX Selects GE's LIM LSR for Complex, Precision Tubing in its Award-Winning EnteraLite-® Infinity-® Feeding Pump

WILTON, CONN. - Jan. 17, 2006 - ZEVEX International, Inc., a Salt Lake City, Utah manufacturer of enteral nutrition pumps and disposable sets, has selected GE - Advanced Materials' injection-molded LIM* 6050-D2 liquid silicone rubber (LSR) to design a complex, patented precision tubing component used exclusively with ZEVEX's EnteraLiteÂ-® InfinityÂ-® Feeding Pump. Traditionally smooth,...

Read More »

Semiconductor Wafer addresses classic heat problems.

Available in 10 x 10 mm square pieces, GaN-on-diamond Xero Wafer(TM) consists of gallium nitride layer atomically attached to freestanding, polycrystalline chemical-vapor-deposited diamond substrate measuring 25 microns thick. GaN that is exposed offers atomically smooth surface finish that is epi-ready for further epitaxial deposition. Sub-nanometer proximity of chip's active region to diamond...

Read More »

DSP Cores suit wireless, voice, and multimedia systems.

Featuring cached memory, Models ZSP410, ZSP520 and ZSP560 enable designer to choose how to distribute instructions and data between on-chip and external memory. For IP phones, ATA modules, portable media players, and 2/2.5/3G handsets, large programs can be managed by storing most program code and data off-chip. Voice software for cores includes all G.7XX codecs, as well as algorithms for...

Read More »

Thermoplastic Elastomers bond to various nylon materials.

VERSAFLEXÂ-® OM6200 Series TPEs provide bond/overmold across nylon substrate types as well as modified nylons. Varying nylon type (6, 6/6, 6/6/6) or modifying nylon with colorants, impact modifiers, or lubricants has minimal impact on effects of TPE. Developed to process in insert molding and 2 shot molding, grades do not require drying of TPE or nylon substrate prior to molding. Grades come...

Read More »

All Topics