Materials

Anpath Group, Inc. Announces Development and Marketing Agreement with Foster- Miller, Inc.

MOORESVILLE, N.C., Feb. 19 - Anpath Group, Inc. (BULLETIN BOARD: ANPG) , reported today that its wholly owned subsidiary, EnviroSystems, Inc. (ESI) announced completion of a development and marketing agreement with Foster-Miller, Inc., a wholly owned subsidiary of QinetiQ North America and part of its Technology Solutions Group for the purpose of promoting the joint sales of ESI's disinfectant...

Read More »

Natureflex(TM) Goes Carbonzero

Innovia Films has achieved CarbonZero status on its full range of NatureFlex(TM) coated biodegradable and compostable packaging films through the implementation of carbon-reduction schemes. NatureFlex(TM) is one of the few packaging materials that has been tested to and complies with the specification required for soil, home composting and waste water applications at ambient temperatures, as well...

Read More »

Ceramic Crystals target consumer electronics market.

Shock-resistant and designed for high-temperature reflow, B-Series SMD Crystals are available in wide range of package sizes. Ultra-mini units come in 2.5 x 2.0 mm package with frequency range of 16-60 MHz and 3.2 x 2.5 mm package with 13-54 MHz frequency range. Crystals are RoHS-compliant and suited for digital video, digital still camera, PDA, PC, office automation, wireless, and audio realms.

Read More »

AT&T Adds to HSUPA Device Lineup with Two New LaptopConnect Cards from Option

Option GT Ultra and Option GT Ultra Express Available for Use on AT&T's 3G BroadbandConnect HSPA Network SAN ANTONIO, Feb. 14 -- AT&T Inc. (NYSE:T) announced today two new LaptopConnect cards from Option, the GT Ultra and GT Ultra Express. The new cards deliver enhanced mobile broadband performance across two popular notebook computer formats, PC Card and ExpressCard. Both of these new devices...

Read More »

Honeywell's High-Strength Spectra-® Fiber Helps Make Curtains Hurricane-Resistant

Protective curtains can withstand large projectile impact and winds in excess of 155 mph ORLANDO, Fla., Feb. 13 -- Honeywell (NYSE:HON) announced today that its high-strength Spectra-® fiber, commonly used in bullet-resistant body armor, is a key component in novel curtains that can protect windows and doors during hurricanes. Honeywell Spectra fiber enables the roll-down curtains, sold by North...

Read More »

Georgia-Pacific Building Products Showcases Industry Leading Building Materials and Innovative Solutions at the 2008 International Builders' Show

ORLANDO, Fla., Feb. 13 -- Georgia-Pacific Building Products continues to strive for innovation in construction, featuring a number of industry-firsts at the 2008 International Builders' Show. Among them are next generation exterior wall sheathing, an open web I-joist and new extended exposure warranties for two paperless gypsum building materials that are superior to the warranties of any other...

Read More »

MeadWestvaco Expands Tango Advantage Product Line to Include Recycled Coated Cover

RICHMOND, VIRGINIA - February 13, 2008 - MeadWestvaco Corporation (NYSE: MWV) announced today it will expand its coated cover product line to include 10 and 12 pt Tango Advantage Recycled C1S and C2S, furthering its commitment to sustainability focused printing and packaging solutions. This is an exciting addition to the Tango Advantage family of products, said Kevin Clark, business manager for...

Read More »

DSM Somos-® Announces Record Sales Year, Credits Extensive New Product Introductions

DSM Somos® Announces Record Sales Year, Credits Extensive New Product Introductions DSM Somos, a world leader in the development of innovative, high-performance stereolithography (SL) materials, announced that 2007 was a record year in sales for the company, crediting the result to wide market acceptance of their extensive list of new products introduced from late 2006 through 2007. Among the...

Read More »

IAR Systems Partners with System Semiconductor on Motion Controller Developer's Kit

IAR Systems has announced that IAR Embedded WorkbenchÂ-® has been selected by System Semiconductor for inclusion in its newly announced M3000 Developer's Kit for chip level motion control. The M3000 Developer's Kit contains all the tools needed to begin developing applications using the System Semiconductor M3000 Motion Controller, which is a highly integrated, mixed signal system-on-a-chip....

Read More »

CEVA Extends Its CDMA Market Reach with VIA Telecom's Latest Design Wins

Dopod, Inventec Applicances and Cal-Comp Electronics join growing list of handset ODMs and OEMs deploying CEVA-powered, VIA Telecom CDMA chipsets BARCELONA, Spain, Feb. 11 -- Mobile World Congress 2008 -- CEVA, Inc.[(NASDAQ:CEVA); ], the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced the CEVA-TeakLite(TM) DSP Core is at the heart of VIA...

Read More »

All Topics