Epoxies

Epoxy features built-in cure indicator.

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of...

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Resins

Acrylic Capstock Resin provides weatherability to HIPS.

Solarkote® H Acrylic Capstock imparts weatherability to high-impact polystyrene (HIPS) sheets via co-extrusion. It provides protection from ultraviolet light for HIPS substrates without sacrificing impact performance of composite sheet. Co-extruded Solarkote H acrylic cap layers are inherently colorless. Cap layer screens out UV while maintaining high visible light transmission.

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Conductive Adhesive is silver-filled.
Adhesives

Conductive Adhesive is silver-filled.

QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150°C. This product can perform in lead-free, 260°C reflow applications. Hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on organic and metal surfaces. Its adhesion mechanism compensates for fluorine...

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Epoxy Adhesive cures at low temperatures.
Epoxies

Epoxy Adhesive cures at low temperatures.

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.

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How to Choose the Right Adhesive Tape for Your Application
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How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

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Epoxy provides clear lamination.
Epoxies

Epoxy provides clear lamination.

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

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Epoxies

Universal Epoxy bonds well with glass ceramic.

AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and...

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