One Part, Toughened Epoxy for Dam-And-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure...
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BARplast LLC at SEMICON West presenting High Performance Polymers - Polyimides and PEEK
BARplast LLC, a distributor of high-performance plastics, will exhibit in SEMICON West 2023. BARplast will showcase its latest products, including AURUM®, a Thermoplastic Polyimide (TPI) from Mitsui Chemicals, PBI, PIs Thermosetting Polyimide, and PEEK, during the event. AURUM® is a high-performance thermoplastic with Properties such as low outgasing, high purity, excellent tribological...
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Avanti Adds Grouts to Growing NSF/ANSI/CAN 61 Certified Product Line
Webster, Texas (November 29, 2022) – Avanti International’s AV-150 Acrylate Gel™ and AV-278 Low Vis Hydro™ are now certified by the Water Quality Association (WQA) as tested and certified as complying with NSF/ANSI/CAN 61 - Drinking Water System Components. Avanti’s injection grout products are used to stop leaks, stabilize soil, and control groundwater in municipal, industrial, and...
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Tekra Carries 3M Medical Tapes
New Berlin, WI-Tekra, a Mativ brand, is proud to carry a full line of 3M™ Medical Materials and Technology products. We offer stick-to-skin adhesive, medical grade tapes, adhesive tapes for medical devices, clinical diagnostics and the retail marketplace. 3M™ Medical Grade Adhesive Tapes Tekra can help choose the right medical tape combination for your medical project. Whether you’re...
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Customized Silicone Technology: For Today's and Next Generation Electronic Applications
This white paper provides and in-depth overview into the customized silicone technology for electronic protection.
Read More »MacDermid Alpha Presents, at PCIM Europe, Sharing The Latest Sintering Innovations for Power Electronics Packaging and Assembly, with Expert Guidance on Options for Challenging Applications Beyond Die Attach.
(Waterbury, CT USA) – 1 May 2023 – MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in...
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Thixotropic Epoxy Features Low Coefficient of Thermal Expansion
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional...
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Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature...
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New 1045-M Adhesive for Medical Device Assembly
Designed to bond the glass, SS, ABS and PC substrates. Cures tack-free with UV/Broad Spectrum light and is LED-curable at 365 nm in 5 seconds. Used to assemble prefilled syringes, single-use devices, auto, pen and wearable injectors.
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New Silver Sintering Paste for Electric Vehicle Power Inverters
Provides high thermal and electrical conductivity. Designed for die, top side or package attach. Suitable for fabrication of smaller, lighter, and reliable power train system.
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Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and...
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DoorKing's 1601 Lane Barrier Provides a Higher Level of Traffic Control for Less
DoorKing is proud to introduce an easy add-on to its 1601 Barrier Gate Operator: The 1601 Traffic Lane Barrier. The barrier gate provides greater traffic control while eliminating the need for bollards or crash beams. Check out this video to learn more.
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