Potting Compound dispenses from disposable static mixers.

Potting Compound dispenses from disposable static mixers.

Following dispensing, Trigger Cure(TM) 9-20675 A/B 2-part potting compound forms -¼ in., UV-cured layer on top in 20 seconds or less that provides protection and integrity to surface. Interior gels within 15-20 minutes at room temperature to depths of 1 in. or more. Optimum properties are achieved in 48 hours at room temperature. With no exotherm, soft, rubbery encapsulant protects and cushions...

Read More »

Urethane Adhesive bonds plastics.

Hysol-® U-09FL features storage stability, and once mixed, offers 10 minute work-life. Two-component urethane cures at room temperature in 3-24 hr. Ultra-clear and highly flexible, product is suited for applications that require clear, non-yellowing bondline. Hysol U-09FL bonds polycarbonate and variety of other plastics, as well as glass and metal.

Read More »

Polyurethane Potting Compound protects electronic SMT parts.

Flexible polyurethane potting and encapsulating resin system 20-2353 imparts no stress on delicate/sensitive electronic surface mount components during cure or when thermal cycled in electronic assemblies. Suited for continuous exposure in wet environments, it does not absorb any moisture and maintains flexibility down to -70-

Read More »
Pressure Sensitive Tapes suit appliance industry.

Pressure Sensitive Tapes suit appliance industry.

Tensilized Polypropylene Tapes secure appliance components during manufacturing, assembly, and transport. Type 53000 PV1 adheres to low energy surfaces such as powder-coated metal. It combines aggressive holding power with clean removal characteristics. Type 4576 serves as filter for securing insulation in refrigeration units as it is being applied. Permeable tissue backing allows only air to...

Read More »
Flip Chip Bonder offers 8 micron placement accuracy.

Flip Chip Bonder offers 8 micron placement accuracy.

Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53 mm-²...

Read More »
Foam Tape suits assembly and construction applications.

Foam Tape suits assembly and construction applications.

Backed by paper release liner, Scapa P3209 closed-cell, PVC-foam tape is single coated with acrylic, pressure-sensitive adhesive. Soft, multi-purpose tape produces watertight seal, is UV resistant, and is fire rated to DIN 4102 part 1, B2. Applications include window glazing, partition wall construction, and sealing glass walls in chiller cabinet, refrigerator, and freezer assembly applications.

Read More »

High-Strength Epoxies bond UV-blocking substrates.

EMCAST V-150 and V-151 epoxy adhesive systems mate 2 UV-blocking substrates by pre-exposing epoxy adhesives to UV and visible light, then, after surfaces are mated, using room temperature or heat cure to solidify bond. EMCAST V-150 has 12,000 cps viscosity, 77 Rex D hardness, 4,400 psi tensile strength, and lap shear strength to 3,500 psi. EMCAST V-151 exhibits 15,000 cps viscosity, 82 Rex D...

Read More »

All Topics