Flexible Adhesive suits high-speed component attachment.
Epoxies

Flexible Adhesive suits high-speed component attachment.

Tra-Duct 926K01 consists of silver, 2-part epoxy adhesive that develops electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Able to be heat cured in one hour at 100°C, medium viscosity product is recommended for electronic bonding, coating, and sealing applications. It can be used as flexible cold-solder for heat...

Read More »
Sealants

Sealing Film suits needs of bio-analytical environments.

Sterile and non-sterile 96-Well Pattern Sealing Film has no adhesive around wells to prevent tacky/sticky adhesive from adhering to plastic pipette tips or metal probes. Employing solvent-free adhesive, sealing film is available in 2 or 5 mil thick Teflon, which is compatible with aqueous solutions and organic solvents and is pierceable with single/multichannel pipettors and robotic probes....

Read More »
One Part Epoxy features low viscosity and rapid cure.
Epoxies

One Part Epoxy features low viscosity and rapid cure.

Type EP3RRLV cures in 30-35 min at 220°F and 10-15 min at 300°F. It offers electrical insulation, thermal shock and heat resistance, and protection against water and chemicals. Epoxy requires no mixing and has unlimited working life at room temperature. It bonds to metals, ceramics, glass, and most plastics. Suited for potting, encapsulation, and underfill applications, EP3RRLV has...

Read More »
Adhesive Tapes

Pressure Sensitive Adhesive Tapes are electronically clean.

ARclean® tapes, suited for HDD assembly applications, offer low-outgassing and are available with permanent or cleanly strippable properties for rework. Acrylic acid-free products have low VOCs and low extractable ions. Products include ARclean® 8906 double-sided, 4-mil, clear, polyester film tape; ARclean® 9019, 2-mil, thermally printable, white polyester film; ARclean®...

Read More »
Adhesives bond magnets, speakers, and electrical wiring.
Adhesives

Adhesives bond magnets, speakers, and electrical wiring.

Suited for cold bonding close fitting, opaque substrates to steel housings, 800 Series adhesives cure with activator for interfacial bonding in 30-60 sec and exhibit gap filling capabilities and thermal shock resistance. Multi-Cure 600 Series adhesives, offered in 4 types, cure on surfaces in as little as 10 sec when exposed to UV light. Uses include wire tacking, strain relief, and seam sealing.

Read More »
Epoxy Adhesive/Sealant resists temperatures to 600°F.
Sealants

Epoxy Adhesive/Sealant resists temperatures to 600°F.

Single-component, heat-curing EP17 is chemically resistant and bonds to substrates such as metals, glass, ceramics, vulcanized rubbers, and plastics. With operating range of -300 to 600°F, 100% reactive product contains no solvents or diluents and will not sag or drip on vertical surfaces. Product cures at temperatures from 300-350°F in 60-90 min and has tensile strength is 8,700 psi,...

Read More »
Epoxy works with difficult-to-bond metals.
Epoxies

Epoxy works with difficult-to-bond metals.

TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75°C and in 24 hr at 25°C.

Read More »
Encapsulants

Reflow Encapsulant provides single-pass curing.

With blue color to aid visual inspection, SE-CURE® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip...

Read More »
Encapsulants

Reflow Encapsulant suits flip chip-on-flex applications.

SE-CURE® 9110 series consists of single-component materials that perform as epoxy-based flux and underfill encapsulants. Series uses compression-flow technique and enables concurrent processing of typical surface-mount components with flip chips in single reflow profile. Resin system provides eutectic and lead-free assembly solution in one material that offers protection from mechanical...

Read More »

All Topics