Adhesives

Structural Acrylic Adhesive is non-sagging.

SPEEDBONDER(TM) H8000 delivers impact- and peel-resistant bonds on various surfaces including metals and composites. Product consists of 100% reactive, 2-component gel that cures at room temperature and bonds to materials with little or no surface preparation. Capable of filling gaps as large as 0.5 in., adhesive also offers environmental resistance. Product is packaged in 490 ml EPS cartridges,...

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Adhesive and Coating withstands temperatures to 2,400°F.
Adhesives

Adhesive and Coating withstands temperatures to 2,400°F.

Ceramacoat(TM) 512N high-temperature adhesive and ceramic coating system is used in assembly of ceramic, metal, and plastic electrical components and as coating of high temperature structures requiring corrosion protection. Single part, water-based, silica-filled system offers volume resistivity of 109 ohm-cm and dielectric strength of 250 V/mil at room temperature. Odorless product contains no...

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Platemounting Tapes suit flexographic printing industry.
Adhesive Tapes

Platemounting Tapes suit flexographic printing industry.

SteelMaster LT adhesive holds photopolymer plates .067 in. and thinner onto steel cylinders. Able to hold during print run, it removes with ease upon job completion. Non-building adhesive maintains initial level of holding power over time. Suited for combination printing, medium-density 52121 Softprint SteelMaster foam tape is coated with SteelMaster LT and allows for fine dot reproduction of...

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PBT Resins meet UL94-V0 specs in thin-walled components.
Resins

PBT Resins meet UL94-V0 specs in thin-walled components.

Flame-retardant Celanex® 14 Series polybutylene terephthalate resins are non-blooming, so molded parts are essentially free of surface deposits. Celanex 3314, 3214, and 3114 are 30, 15, and 7.5% glass fiber-reinforced, respectively. Celanex 2014 is unfilled, and Celanex 4014 is unfilled and toughened. Resins are suited for connectors, housings, relays, switches, motor end caps, and other...

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Underfill Material is formulated for flip chip packaging.
Epoxies

Underfill Material is formulated for flip chip packaging.

Hysol® FP4580 low stress liquid epoxy prevents cracking and delamination of chip's inner layers. It works on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4,000 solder bumps. When fully cured, product forms rigid, low warp seal that dissipates stress on solder joints and extends thermal cycling performance. Hysol® FP4580 underfills devices with gaps as small as...

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Heat Vacuum Applicator offers complete temperature control.
Presses

Heat Vacuum Applicator offers complete temperature control.

AppliPhase HVA enables operators to set control unit for temperature and length of exposure to ensure correct bonding of flexible back-light signage transfers, reflective sheeting, Panaflex signs, backlit awnings, traffic signs, and premask application tape. Features include steel construction and oil-free vacuum pump. Lamp bank and diaphragm may be raised to offer clearance for handling of...

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Adhesives produce humidity- and weather-resistant bonds.
Adhesives

Adhesives produce humidity- and weather-resistant bonds.

Plastic Welder(TM) non-sagging structural methacrylate adhesives require little or no surface preparation and offer impact and peel resistance. Available in black, white, or off-white, product bonds engineered plastics and dissimilar substrates. It can be used at service temperatures to 250°F and cures at room temperature. Packaging includes 25 ml Dev-Tubes(TM) with built-in plungers; 47 or...

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Adhesive bonds plastics in seconds without crazing.
Adhesives

Adhesive bonds plastics in seconds without crazing.

UV/visible light curing Ultra Light-Weld® 3094 Series forms clear bonds and does not cause crazing or blooming on plastics. Bonds have gap filling capability and maintain strength through thermal cycling as well as shock, vibration, and impact. Material, available in viscosities of 1,000 cp, 8,000 cp, and 25,000 cp non-flowing gel, cures upon exposure to wavelengths ranging from 300-500 nm....

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RTV Silicones are suited for electrical applications.
Encapsulants

RTV Silicones are suited for electrical applications.

Solarite SI-200 Series Room Temperature Vulcanizing (RTV), 2-component, electrical potting and casting silicones are available in hardness ranges from 80A (semi-rigid) to 00 (gels). Gels are re-enterable and cure to elastic Shore 00 form with no surface residue. Products are UL-94V-0 approved, cure with high gloss, and produce void-free castings in potted electrical devices. Characteristics...

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Epoxy Adhesive cures in as little as 3 minutes.
Epoxies

Epoxy Adhesive cures in as little as 3 minutes.

TRA-BOND 224-1 cures in 4 hrs at room temperature or 3 minutes at 95°C. Fast cure has 30 min work life after dispensing. Its 20,000 cps viscosity ensures that product will flow into most small voids and creases. With shelf life of up to 1 year, hard adhesive can be used in applications from encapsulation to component staking and sealing. Package options include BI-PAX and premixed, frozen...

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