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Adhesives & Sealants
QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150°C. This product can perform in lead-free, 260°C reflow applications. Hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on organic and metal surfaces. Its adhesion mechanism compensates for fluorine and backside... Read More
ARclad® pressure-sensitive foam glazing tapes offer cold flex, good sealing characteristics, and cyclic shock resistance. They require no cure time, apply and adhere without oozing, and require no cleanup. ARclad® 2000 glazing tapes offer high shear and internal strength. ARclad® 8231 double-faced glazing tape delivers permanent anchorage to foam. ARclad® pressure-sensitive foam muntin... Read More
CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of stable... Read More
AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and multifiber... Read More
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