YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Epoxies

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

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Visual Workplace Launches Floor-Mark Durable Floor Marking Tape with Ultra-Low Profile of 14 mil
Adhesive Tapes

Visual Workplace Launches Floor-Mark Durable Floor Marking Tape with Ultra-Low Profile of 14 mil

Visual Workplace, Inc. introduces a durable, high-performance floor marking tape for marking floors and reinforcing workplace standards in industrial environments. Floor-Mark® provides amorlike protection due to its high bond acrylic pressure sensitive adhesive and can conform to uneven surfaces. It overcomes challenges of traditional tape and paint like tripping hazards with its ultra-low...

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New HI-THANE Ink Binders and Adhesives are Suitable in Flexible Packaging Industry
Adhesives

New HI-THANE Ink Binders and Adhesives are Suitable in Flexible Packaging Industry

Songwon offers HI-THANE™ A-9135T and A-9107T ink binders and HI-THANE™ A-7332 adhesive. The ink binders exhibit improved anti-blocking properties and high heat resistance. A-9135T and A-9107T are suitable for applications such as retort pouches, gravure and flexographic printing inks. A-7332 Solvent-free polyurethane laminating adhesive features enhanced wetting properties that reduces...

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Sealing Equipment Buying Guide
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Sealing Equipment Buying Guide

Can't tell the difference between all the different types of sealing equipment? Download this informative sealing equipment buying guide to learn the types, methods, and applications that are available to you.

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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Epoxies

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

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New Metal-Resin Bonding Technology Uses Metal Insert Molding
Resins

New Metal-Resin Bonding Technology Uses Metal Insert Molding

Poltplstic’s Quick-10® Metal-Resin Bonding Technology is used in bonding metal parts and resins by a molten resin applying via injection molding to metal parts that have gone surface treatment. The technology is suitable for mobile device parts such as mobile phones, tablets and digital cameras. Resin composites exhibits properties of metals and engineering plastics. Quick-10 utilizes quick...

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New Electrically Conductive Adhesives Increase Module Performance
Adhesives

New Electrically Conductive Adhesives Increase Module Performance

Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...

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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Epoxies

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...

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New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality
Sealing Equipment

New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality

Ossid’s TS-72 Sealing/Lidding Machines are used for packaging beef, chicken, pork and seafoods in trays, cups, rounds and vacuum packs. The machine provides high yielding output with an operating cycle of up to 15 per minute. Units are available for ambient, modified atmosphere packaging (MAP) and MAP with vacuum applications. TS-72 machines allow production of range of stock keeping units on...

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