Low-Voiding Solder Paste suits fine-pitch applications.
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Press Release Summary:
Designed for high-volume stencil printing applications with CSP lead pitches of 0.5 and 0.4 mm, Multicore® LF328 is formulated to deliver low voiding in BGA joints. It provides tack force sufficient to resist component movement during high-speed placement and enables print speeds with print pressure that minimizes board warpage. Classified as ROL0 to ANSI/J-STD-004, is halide-free, no-clean solder material that meets Pb-free process requirements.
Original Press Release:
New Low-Voiding, Lead-Free Solder Material from Henkel Delivers Advantages for Fine-Pitch Applications
Continuing to lead the industry with innovative products for lead-free manufacturing, the electronics group of Henkel has announced the development of yet another advanced solder material for today's Pb-free process requirements. Multicore® LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5mm and 0.4mm. As lead-free manufacturing becomes the norm as opposed to the exception, the ability to reliably process finer pitched devices within Pb-free parameters will be vital. Henkel has anticipated this requirement and has delivered a material solution that addresses the emerging needs of the dynamic electronics market.
Different from competitive products, Multicore LF328 has been formulated to deliver low voiding in BGA joints, which is a characteristic that delivers tremendous production advantages. With superior performance over a wide range of reflow profiles and long abandon time capabilities, Multicore LF328 gives assemblers of advanced electronic devices the flexibility they require when running lead-free processes. The material also provides an outstanding tack force to resist component movement during high speed placement, allows a fast print speed with low print pressure to minimize board warpage and offers superior humidity resistance. These factors, along with the material's excellent soldering activity on a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper, enable manufacturers to confidently incorporate Multicore LF328 into their lead-free production processes.
In addition to its exceptional process performance, Multicore LF328 also helps lower manufacturing costs and maximizes production efficiencies. The material produces safe residues, which eliminate the need for cleaning, and its post-reflow low color residues simplify the visual inspection process.
Multicore LF328 is classified as ROL0 to ANSI/J-STD-004. For more information on this material or any of Henkel's advanced lead-free products, call 949-789-2500 or log onto www.electronics.henkel.com.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Contact
Henkel Corporation: doug.dixon@us.henkel.com
Doug Dixon, www.electronics.henkel.com
Phone: 949-789-2500
Fax: 949-785-2595
