High Flow Underfill cures rapidly at low temperature.
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Press Release Summary:
Formulated for use with CSP and BGA packages, Loctite® 3549 underfill protects solder joints against shock, drop, and vibration. Material has been tested to JEDEC drop test standards on 0.4 and 0.5 mm lead-free devices. Compatible with lead-free solder materials, underfill is completely reworkable and features a pot life of 14 days at room temperature and 7 days at 40°C processing temperature.
Original Press Release:
New Reworkable CSP/BGA Underfill from Henkel
New from the electronics group of Henkel, Loctite® 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages. The innovative material is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the printed circuit board (PCB) and allows for in-line curing to increase device throughput.
When fully cured, Loctite 3549 delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices and testing confirms its superiority over competitive materials when subjected to these stresses. In addition, testing of the material to JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices has shown that Loctite 3549 offers five times the reliability over non-underfilled Pb-free devices.
Loctite 3549 also delivers great levels of flexibility, as the product is compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCB's. Additional benefits of the material include its long pot life and simple, standard refrigeration temperature storage.
Cost-savings and production efficiencies are necessities for today's electronics firms and, like all Henkel materials, Loctite 3549 was formulated with these goals in mind. Due to the product's long pot life, which is 14 days at room temperature and up to 7 days at processing temperature (40oC), its simplified storage, low temperature cure and reworkability, manufacturers incorporating Loctite 3549 will realize significant energy and process cost savings.
For additional information on Loctite 3549 or to find out how Henkel's material solutions can enable process efficiencies, call 949-789-2500 or log onto www.electronics.henkel.com.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Contact
Henkel Corporation
Doug Dixon
doug.dixon@us.henkel.com
www.electronics.henkel.com
Phone: 949-789-2500
Fax: 949-785-2595
