Murata Launches LBAD0ZZ1RX NBIoT Cellular Wireless Module with an Arm Cortex M0 Processing Core
The LBAD0ZZ1RX NBIoT Cellular Wireless Module is designed for battery powered IoT/IIoT applications. The module is offered with HiSilicon Hi2115 single-die wireless SoC device, a DC/DC converter, a power management IC and wireless front end matching components. It comes with UART, I²C and SPI along with GPIO and an ADC interfaces. The unit’s processing core is equipped with 64 kBytes of SRAM...
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Murata Launches LBAD0ZZ1RX NBIoT Cellular Wireless Module with an Arm Cortex M0 Processing Core
The LBAD0ZZ1RX NBIoT Cellular Wireless Module is designed for battery powered IoT/IIoT applications. The module is offered with HiSilicon Hi2115 single-die wireless SoC device, a DC/DC converter, a power management IC and wireless front end matching components. It comes with UART, I²C and SPI along with GPIO and an ADC interfaces. The unit’s processing core is equipped with 64 kBytes of SRAM...
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Latest Automotive Intelligent Power Modules Help in Reducing Fuel Consumption and CO2 Emissions for Vehicles
The FAM65xxx Automotive Intelligent Power Modules are designed for on-board charging and high-voltage DC-DC conversion application for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). The FAM65xxx APM16-packaged devices feature an internal direct bonded copper structure that is isolated to 5 kVAC/sec. The modules are equipped with an integrated high voltage capacitor that...
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Latest Automotive Intelligent Power Modules Help in Reducing Fuel Consumption and CO2 Emissions for Vehicles
The FAM65xxx Automotive Intelligent Power Modules are designed for on-board charging and high-voltage DC-DC conversion application for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). The FAM65xxx APM16-packaged devices feature an internal direct bonded copper structure that is isolated to 5 kVAC/sec. The modules are equipped with an integrated high voltage capacitor that...
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Checklist: How to Get the Right Belt the First Time
This guide is intended to help identify and address application criteria necessary to specify the right belt to deliver a highly efficient, reliable product.
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On Semiconductor Offers New Power Integrated Modules with Direct Bound Copper Substrate
The NXH160T120L2Q1SG and NXH160T120L2Q2F2SG Power Integrated Modules are available in Q1 and Q2 packages and are designed for and 50 KW inverters. The device’s DBC allows high current operation with minimal effects from parasitic inductance. The modules enable designers to gain high switching speeds and deliver 3000 Vrms of isolation with 12.7 mm creepage distance. These units are used in...
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On Semiconductor Offers New Power Integrated Modules with Direct Bound Copper Substrate
The NXH160T120L2Q1SG and NXH160T120L2Q2F2SG Power Integrated Modules are available in Q1 and Q2 packages and are designed for and 50 KW inverters. The device’s DBC allows high current operation with minimal effects from parasitic inductance. The modules enable designers to gain high switching speeds and deliver 3000 Vrms of isolation with 12.7 mm creepage distance. These units are used in...
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VadaTech Introduces VPX551 FPGA Module with Tier 2 Platform Health Management/Monitoring Capability
The VPX551 FPGA Compute Module is designed for signal processing and beamforming applications. The product offers dual Kintex UltraScale™ XCKU115 FPGAs with over 1,400K logic cells each. The unit interfaces directly to rear I/O via SERDES, LVDS and fiber. The modules can be connected by four SERDES lanes for high speed communication and load sharing. The VPX551 features an on-board management...
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VadaTech Introduces VPX551 FPGA Module with Tier 2 Platform Health Management/Monitoring Capability
The VPX551 FPGA Compute Module is designed for signal processing and beamforming applications. The product offers dual Kintex UltraScale™ XCKU115 FPGAs with over 1,400K logic cells each. The unit interfaces directly to rear I/O via SERDES, LVDS and fiber. The modules can be connected by four SERDES lanes for high speed communication and load sharing. The VPX551 features an on-board management...
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New SX-SDMAC Wireless Driver Supports SPI/UART Interface
The SX-SDMAC Smart-Ready SDIO Module comes with onboard antenna and U.FL connector add-on. The SX-SDMAC provides am integration of WLAN and Bluetooth low energy technology that support 802.11a/b/g/n/ac Wi-Fi and Bluetooth 4.2 + HS. The product is available as single or dual-band 802.11n module. The driver module is based on QCA4004 SoC and is built into the i.MX RT SDK. It provides...
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New SX-SDMAC Wireless Driver Supports SPI/UART Interface
The SX-SDMAC Smart-Ready SDIO Module comes with onboard antenna and U.FL connector add-on. The SX-SDMAC provides am integration of WLAN and Bluetooth low energy technology that support 802.11a/b/g/n/ac Wi-Fi and Bluetooth 4.2 + HS. The product is available as single or dual-band 802.11n module. The driver module is based on QCA4004 SoC and is built into the i.MX RT SDK. It provides...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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