Burn-in Test Socket accommodates QFN74 with exposed pad.
Socket and Test your 4.5x12.5mm QFN74 device using extreme temperature socket EAGAN, MN – Ironwood Electronics recently introduced a new Stamped spring pin socket addressing burn-in test requirements for testing 74 lead QFN - CBT-QFN-7038. The contactor used in CBT-QFN-7038 socket is a stamped spring pin with 15 gram actuation force per ball and cycle life of 10,000+ insertions. The self...
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Burn-in Test Socket accommodates QFN74 with exposed pad.
Socket and Test your 4.5x12.5mm QFN74 device using extreme temperature socket EAGAN, MN- – Ironwood Electronics recently introduced a new Stamped spring pin socket addressing burn-in test requirements for testing 74 lead QFN - CBT-QFN-7038. The contactor used in CBT-QFN-7038 socket is a stamped spring pin with 15 gram actuation force per ball and cycle life of 10,000+ insertions. The self...
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Elastomer Socket accommodates QFN34 package.
Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance EAGAN, MN -- Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The SG-MLF-7084 socket is designed for a 6mmx4.5mm package size and operates at bandwidths up to 30 GHz with less than 1dB of insertion loss (GSSG configuration). The contact...
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Elastomer Socket accommodates QFN34 package.
Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance EAGAN, MN -- Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The SG-MLF-7084 socket is designed for a 6mmx4.5mm package size and operates at bandwidths up to 30 GHz with less than 1dB of insertion loss (GSSG configuration). The contact...
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Nylon Washers for Your Automotive Applications
This ebook provides an overview of nylon washers in the automotive industry.
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Stamped Spring Pin Test Socket accommodates BGA243 packages.
Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 has- stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is
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Stamped Spring Pin Test Socket accommodates BGA243 packages.
Used for testing 12 x 12 mm BGA243 with 0.6 mm pitch with 243 balls, CBT-BGA-7020 hasÃ- stamped spring pin contactor with 31 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is
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BGA Socket accommodates hybrid memory cube.
Quickly and easily Socket your 1mm pitch, 31x31mm BGA package on any PCB without significant performance loss EAGAN, MN – Ironwood Electronics has recently introduced a new high performance BGA socket for Hybrid Memory Cube (1mm pitch, 900 pin BGA). A hybrid memory cube (HMC) is a single package containing either four or eight DRAM die and one logic die, all stacked together using...
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BGA Socket accommodates hybrid memory cube.
Quickly and easily Socket your 1mm pitch, 31x31mm BGA package on any PCB without significant performance loss EAGAN, MN- – Ironwood Electronics has recently introduced a new high performance BGA socket for Hybrid Memory Cube (1mm pitch, 900 pin BGA). A hybrid memory cube (HMC) is a single package containing either four or eight DRAM die and one logic die, all stacked together using...
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BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.
Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target...
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BGA Socket Adapter accepts 724-pin BGA, 1 mm pitch IC.
Consisting of female socket module and male adapter module, BGA Socket Adapter accommodates 724-pin, 1 mm pitch, 35 x 35 mm IC size. SF-BGA724A-B-42F female socket module can be soldered to motherboard using standard soldering methods without warping. Similarly, BGA device can be soldered to male adapter module. Both are constructed with high-temperature FR-4 substrate, assuring match with target...
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Dies & Stamping Services with Over 25 Years of Experience
PDS is an established leader in progressive die stamping, with a reputation for providing precision and value that dates back more than half a century. Through extensive capabilities and a staff of seasoned professionals, we set the standard for quality, delivering flexible services that can meet the needs of the most challenging requirements. See our video to learn more.
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