Center Probe Test Socket suits devices to 13 mm-².
RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per...
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Low-Profile Socket simplifies board assembly.
Low-profile socket facilitates high-density, side-by-side panel or PCB mounting of IS Series SMARTSWITCH(TM) LCD pushbuttons. SMARTSWITCH(TM) pushbuttons feature high-visibility LCD that can be programmed to display graphics and alphanumeric characters. They can also display animation sequences that prompt operators through series of error-free actuations. Backlighting can be programmed to flash,...
Read More »Center Probe Test Socket has floating guide plate.
Machined from Torlon 4203 or 5530, RF center probe socket features floating guide plate with built-in hard stop. Product can be used for packages with 0.50 mm pitch or higher for devices up to 55 mm wide in applications with speeds from 1-10+ GHz. Decoupling pockets can be placed within 1.0 mm of product's solderless, pressure-mount, compression spring probes. Contacts have cycle life of over...
Read More »Test/Burn-In Socket accommodates devices up to 13 mm-².
Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact...
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The Ultimate Guide To Hydra Pneumatic and Servo Cylinders
This white paper provides a guide to hydra pneumatic and servo cylinders.
Read More »BGA Socket is side stackable to increase packaging density.
Offered in 2- and 4-bolt hold-down styles, Pin-Ball Socket may be soldered side-by-side, directly to existing footprint of PC board. Surface-mount BGA and LGA socket provides 2 mm clearance for end components. It can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint, on any size board. Socket incorporates spring-probe technology with spring force of 17 g at .025 in....
Read More »RF Test Sockets feature conduction-cooled system.
Interposer, Spring Probe, and Microstrip Contact(TM) test sockets are 63.5 x 63.5 x 88.9 mm and can be used in packages up to 27 x 27 mm. They include built-in thermistor and copper heat sink with integrated fan assembly. Conduction-cooling system makes sockets suitable for BGA, LGA, and CSP package designs used in high-powered devices. Temperature range with thermoelectric cooling is 5-194Ã-
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Cable Assemblies/Sockets meet IDB/IEEE 1394 standards.
IDB IEEE1394 Consumer Convenience Port Connectors are offered in lengths up to 10 m and in 4 different versions: bilingual plug to bilingual plug, bilingual plug to beta plug, bilingual plug to IEEE 1394 AV plug, and bilingual to IEEE 1394-95 plug. Hot-pluggable units have positive locking feature and audible click. Copper-based system supports transmission speeds up to 1,600 Mbits/sec. Right...
Read More »Adapter is offered in 28-pin version.
Correct-A-ChipÃ-® allows SSOP devices to be used on boards designed for older SOWIC packages without board rework or redesign. It is offered in 20- and 28-pin versions. SSOP 0.65 mm pitch package can be hand soldered or attached by standard SMT soldering on adapter's top side. Pins are hardened brass alloy with tin-lead plating. Operating temperature range is -67 to 257Ã-
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Socket offers high-density BGA packaging.
Micro PGA socket is available in 478 circuits and can be used with IntelÃ-® Mobile PentiumÃ-® 4 Processor-M Series and CeleronÃ-® processors. Self-centering BGA solder balls help prevent bent leads. Socket is 3.30 mm high and based on 1.27 mm grid array. Chamfered-contact design provides low insertion force. LCP housing and cover withstand high-temperature soldering environments,...
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Test Socket handles device types up to 27 mm.
Integra 27 has molded PPS plastic components designed to minimize space without sacrificing repeatability and durability. Device-specific spring probe insert can be machined to match testing needs. Socket's contacts are IDI spring probes, some which are electrically characterized to 10 GHz. Contacts are durable enough to handle burn-in and HAST testing. User replaceable contacts have current...
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Ensure Safety, Reliability in Your Cement Plant with Aerzen Blowers and Compressors
Aerzen offers blowers and compressors for challenging cement applications such as pneumatic conveying from raw mill to raw meal silos, combustion air, cement silos fluidization, and more. At Aerzen, safety is our top priority. Check out our video to learn more.
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