Micro Card Interfaces require minimal board area.
Surface-mount, 0.025 in. pitch MEC6 Series features double row of phosphor bronze contacts to mate with standard double-sided .062 in. thick cards. Designed with vertical orientation, 7 sizes offer 10, 20, 30, 40, and 50 I/Os per side non-polarized and 50, 60, and 70 I/Os per side with keying feature to assure proper card insertion. Five right-angle styles are available with 10-40 I/Os...
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IC Sockets support dense pitch QFP devices.
With 10 GHz bandwidth, Model SG-QFE-7000 accommodates 128-pin, 14 mm, 0.4 mm pitch TI Power Pad ICs without performance loss. Unit dissipates up to several watts without extra heatsinking and can handle up to 100 W with custom heatsink. Contact resistance is typically 23 mW per pin. Constructed with low inductance elastomer, sockets feature temperature range of -35 to +85Ã-
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Spline Sockets are made from aircraft quality steel.
Suitable for use on spline fasteners and 4, 6, and 12 point fasteners, spline sockets line includes 55 SKUs, in Ã-¼, 3/8, Ã-½, Ã-¾, and 1 in. drive models. Geometric profile of socket's 12 teeth offers large contact area between tool and spline fastener that allows user to apply more torque without damaging tool or fastener head. Sockets loosen partially rounded hex fasteners and meet...
Read More »Piper Plastics Manufactures Microprocessor Test Sockets Using a Ceramic-Filled Victrex-® Peek-® Polymer
Greenville, SC (July 18, 2006) The Semiconductor industry's demand for smaller, tight tolerance IC packages that operate at higher frequencies is making it increasingly difficult for traditional materials previously used for test socket applications. New, high performance test socket components made from a ceramic-filled VICTREXÃ-® PEEK polymer are available from Piper Plastics Inc., a...
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Specifying Removable Insulation Blankets - A Guide for Engineers
Looking for guidance on how to spec removable insulation? Download our free guide for engineers now!
Read More »BGA Socket accommodates 1.0 mm pitch ICs.
Intended for 23 mm, 22X22 array ICs, 10 GHz Model SS-BGA324J-02-01 dissipates up to 7 W without extra heatsinking and can handle up to 60 W with custom heatsink. Contact resistance is typically 30 mOhm per ball. Constructed with spring pins rated at 500,000 actuations, socket operates from -40 to +150Ã-
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Processor Socket enables PCI Express-® signaling.
Lead-free, 775-position Model LGA775 enables use of microprocessors that support PCI Express signaling in desktop PCs. Utilizing BGA technology for motherboard attachment and LGA interface to microprocessor, socket performs with less than 4 nH inductance and less than 1 pF capacitance pin-to-pin. Pickup cover facilitates placement using pick-and-place equipment, while BGA termination allows...
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Socket is available for 0.50-0.80 mm pitch packages.
Suited for applications using BGA, LGA, CSP, and other devices on 0.50 mm or larger pitch, PinBall(TM) Socket can be soldered side-by-side, directly to existing footprint of PC board. Clearances range from 0.5-2.0 mm, depending on pitch. Constructed of FR-4 material, socket features 63/37 tin-lead solderballs on PCB mating side and male spring probe on device mating side, which offers contact...
Read More »IC Socket tests high-speed devices.
Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125Ã-
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FB-DIMM Memory Socket enables server memory expansion.
Vertical memory module connectors accept DDR2 FB-DIMM (Fully Buffered Dual In-Line Memory Module) assemblies and have card-edge contact design that protects against stubbing. Enabling data rates to 4.8 Gbps, interface utilizes serial differential signaling. Sockets provide mechanical voltage keying and end latches for module retention and ejection. Designed to JEDEC Socket Outline SO-003,...
Read More »Test Socket suits devices from 28-40 mm-².
Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for...
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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.
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