QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
Mountable on any existing PCB, SG-MLF-7028 is designed for 9 x 9 x 1.6 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It is designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Unit features temperature range of -40 to +100Ã-
Read More »BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
Suited for 27 x 27 mm package size, CG-BGA-4002 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. It can handle up to 100 W with custom heat sink, and has contact resistance of 20 mW/pin. Constructed with high performance and low inductance elastomer contactor, unit features temperature range of -40 to +100Ã-
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Transistor Sockets facilitate field insertion and removal.
Inside each Series 917 TO-5 and TO-100 transistor socket are precision-machined, brass alloy receptacles assembled with Mill-Max, 4-finger No. 30 contact. Featuring pin diameter acceptance range of .015-.025 in. and current rating of 3 A per position, No. 30 contact provides hi-rel mechanical and electrical connection to mated transistor lead. Both through-hole and SMT transistor sockets utilize...
Read More »Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...
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Read More »Test Socket is designed for devices up to 13 sq mm.
Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm...
Read More »Center Probe Test Socket handles devices up to 13 mm-².
Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, socket is suited for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.40 mm. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch. Measuring 1.200 x .840 x .440 in., unit...
Read More »Strip-Line and Collet Sockets comply with RoHS standard.
Featuring bifurcated contacts, Series 0501 and 700 strip-line sockets are designed for mounting LCDs and other high-pin count or off-centered components. Optional spacer is available, enabling both series to be mounted on 0.300, 0.600, 0.900, 1.100, and 1.300 in. centers. Also available, Series 0518 collet sockets can be cut to specific number of pins desired to fit application. Adaptable...
Read More »Socket is designed for 1.0 mm pitch BGA packages.
Able to dissipate up to several watts without extra heat sinking, SG-BGA-8000 socket is designed for 31 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It handles up to 100 W with custom heat sink and offers typ contact resistance of 23 mW per pin. Applicable for BGA pitches from 0.8-1.27 mm, socket connects all pins and optional center power pad and...
Read More »RF Sockets suit devices with pitches as low as 0.40 mm.
High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mmÃ-², 14-27 mmÃ-², 28-40 mmÃ-², and 41-55 mmÃ-². With -55 to +150Ã-
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Test Socket suits devices from 28 to 40 mm-².
Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...
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