Center Probe Test Socket suits devices to 13 mm².

Press Release Summary:



RF test socket incorporates solderless, pressure-mount compression spring probes located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Suited for devices with pitches of 0.50 mm and higher in applications with speeds from 1-10+ GHz, signal path during test is .077 in. Center probe contact forces are 9-12 g per contact for 0.50-0.75 mm pitches and 17-20 g per contact for 0.80+ mm pitches.



Original Press Release:



New Aries High Frequency Center Probe Test Socket Available for Devices Up to 13 mm2 with Speeds from 1 GHz to Over 10 GHz



Frenchtown, NJ, August 2003- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has released a new RF test socket for devices up to 13 mm wide, with pitches of 0.50 mm and higher, in applications with speeds from 1 GHz to over 10 GHz. Specific applications for the new test socket include CSP, MicroBGA, MLF, QFN, DSP, LGA, SRAM, DRAM, and Flash devices.

The socket's signal path during test is only .077" (1.95 mm), providing minimal signal loss for higher bandwidth capability and a longer cycle life in automated handler testing. For example, at 11 GHz and a 0.50 mm pitch, the socket can achieve -1 dB of bandwidth. A 4-point spring probe crown ensures scrub on solder ball oxides for reliable contact mating. Additionally, the raised point probe ensures accurate placement and scrub on small pads used on MLF and QFN packages.

The socket incorporates solderless, pressure-mount compression spring probes, accurately located by two molded plastic alignment pins and secured with four stainless steel screws, ensuring fast, easy access for mounting and removal to/from the load board. In addition, the socket's small overall size provides the maximum allowable space for load board components and connectors.

Center probe contact forces are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Estimated contact life is over 500,000 cycles. Operating temperature is -55°C to 150°C (-67°F to 302°F). The spring probes of the new RF test socket are heat-treated beryllium copper alloy, plated with 30 µ" min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's molded components are UL94V-0 Ultem and the machined components are UL94V-0 Ultem or Torlon. All hardware is stainless steel.

As with all Aries sockets, the new RF test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for a 100-lead molded BGA socket (up to 3 GHz) starts at $450 in quantities of 1-4 pieces. Delivery is 2 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Data sheet #24008 - http://www.arieselec.com/products/24008.pdf.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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