Test and Burn-In Socket suits applications up to 1 GHz.
Test and Burn-In Socket accommodates devices from 41-55 mmÃ-² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM,...
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BGA/LGA Socket includes customized heat sink.
Suited for high-end graphics processors, 1,400-contact Pin-Ball Socket can be soldered directly to existing footprint of PC board. Aluminum heatsink provides thermal dissipation of excess heat generated by graphics processors. BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0.80, 1.00, and 1.27 mm pitch packages up to 50 mm. It incorporates spring probe technology...
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Transistor Sockets offer simple installation.
Low-profile, TO-3 Power Transistor Sockets aid in installation of JEDEC-TO-3 MPM Power Transistors by eliminating need to use insulated bushings. Design incorporates collector strip terminal with 6-20 formed threads at either end of socket to facilitate mounting. Additional design elements include nylon tops to accommodate .030, .045, and .090 in. chassis thicknesses and electro-plated, spring...
Read More »Sockets protect image sensors during board processing.
Offered in standard, footprint-specific, and custom configurations, image sensor sockets feature screw-machined terminals and multi-fingered contacts. Standard sockets are available in FR-4 insulators in thru-hole and surface-mount designs. With options such as molded or Peel-A-WayÃ-® insulators and lead-free designs, products are suited for applications from scanners to security systems to...
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Wear - What Wears in Electromagnetic Brakes
Learn the common causes of wear for "fail-safe" brakes and how to prevent wear for safe use.
Read More »Center Probe Socket debugs range of package types.
Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for...
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Retention Mechanism protects graphics card.
Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook...
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SMT Socket offers current rating of 7 A.
Able to accommodate power or signal connection, SMT Bottom Entry, Through Board Socket is suited for high density applications and demanding environments. Mating pin sizes include 0.025 in. square and 0.027-0.032 in. diameter round pins. Material is 0.0005 in. thick beryllium copper with bright tin finish over copper. Socket is available in tape and reel in standard tape pocket format, allowing...
Read More »Sockets accommodate BGA, LGA, and CSP devices to 27 mm-².
Molded from high-temperature thermoplastic, 1.00 mm pitch BGA Sockets in precision molded wafers exhibit coplanarity within .006 in. and feature screw-machined terminals with multifinger contacts and gold plating. Full grid wafers are pin loaded to any footprint specific pattern up to 26 x 26 rows. Surface mount sockets utilize eutectic solder ball terminals, and thru-hole models are available...
Read More »Test Socket tests devices from 14 to 27 mm-² wide.
RF Center Probe Test Socket provides manual testing of devices with pitches down to 0.50 mm in applications with speeds from 1-10 GHz. Four-point spring probe crown ensures scrub on solder ball oxides. With signal path of .077 in., socket provides minimal signal loss. Solderless, pressure-mount, compression spring probes are accurately located by 2 molded plastic alignment pins and secured with 4...
Read More »Test and Burn-In Socket suits applications under 1 GHz.
Designed for use with devices from 14-27 mmÃ-², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302Ã-
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Ensure Safety, Reliability in Your Cement Plant with Aerzen Blowers and Compressors
Aerzen offers blowers and compressors for challenging cement applications such as pneumatic conveying from raw mill to raw meal silos, combustion air, cement silos fluidization, and more. At Aerzen, safety is our top priority. Check out our video to learn more.
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