BGA Socket is side stackable to increase packaging density.

Press Release Summary:



Offered in 2- and 4-bolt hold-down styles, Pin-Ball Socket may be soldered side-by-side, directly to existing footprint of PC board. Surface-mount BGA and LGA socket provides 2 mm clearance for end components. It can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint, on any size board. Socket incorporates spring-probe technology with spring force of 17 g at .025 in. deflection, as well as Ultem insulator with stainless steel hardware.



Original Press Release:



Aries Revolutionary, Cost-Effective Side-Stackable BGA Socket Offers Dramatically Improved Packaging Density



Frenchtown, NJ, April 2003- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has released the first side-stackable BGA socket available on the market. Designated the Pin-Ball Socket, this device can be soldered side-by-side, directly to the existing footprint of a PC board, dramatically improving packaging density. The surface mount BGA and LGA socket provides 2 mm of clearance for end components and can be used for 1.00 mm and 1.27 mm pitch packages up to 50 mm in any footprint and on any size board.

The Pin-Ball Socket incorporates Aries' reliable spring probe technology, with a spring force of 17 grams at .025" deflection. The new socket employs an Ultem insulator with stainless steel hardware. The spring is BeCu alloy and the pins are gold-plated brass alloy.

Users have the choice of a metal cover or customized aluminum heatsink. The socket is available in 2-bolt (15mm package or smaller) or 4-bolt (16-50mm package) hold-down styles, depending upon the device size required.

Pricing for the Pin-Ball Socket starts at $1.00 per ball in quantities of 5 sockets. Delivery is 2 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com;
Web: www.arieselec.com, Data sheet 23022 is available at -www.arieselec.com/products/23022.pdf.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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