Test/Burn-In Socket accommodates devices up to 13 mm².

Press Release Summary:

Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact for 0.80 mm pitches and larger. Socket operating temperature is -67 to 302°F.

Original Press Release:

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket, Available for Devices Up to 13 mm² with Speeds Up to 1 GHz

Frenchtown, NJ, July 2003- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a BGA/CSP test and burn-in socket for devices with a pitch from 0.50 mm or larger in applications of up to 1 GHz. The new socket features a standard molded socket format that can accommodate any device package up to 13 mm². It is ideal for test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.

The socket incorporates solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws, making for easy mounting to and removal from the burn-in board (BIB). The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness. The socket's small overall size allows the maximum number of sockets per BIB, and BIBs per oven, while allowing easy access for fast device insertion and removal.

The socket can accommodate up to 500,000 cycles. Spring probe contacts are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Operating temperature of the socket ranges from -55°C to 150°C (-67°F to 302°F). The socket's molded components are UL94V-0 Ultem and machined components are UL94V-0 PEEK. Spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (.75 µm) gold per Mil-G-45204 over 30 µ" min. (.75 µm) nickel per QQ-N-290. All hardware is stainless steel.

As with all Aries sockets, the new burn-in and test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for a 100-lead socket starts at $175 in single piece quantities. Delivery is 2 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Data sheet #23017- http://www.arieselec.com/Web_Data_Sheets/23017/23017.htm.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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