Socket offers high-density BGA packaging.

Press Release Summary:



Micro PGA socket is available in 478 circuits and can be used with Intel® Mobile Pentium® 4 Processor-M Series and Celeron® processors. Self-centering BGA solder balls help prevent bent leads. Socket is 3.30 mm high and based on 1.27 mm grid array. Chamfered-contact design provides low insertion force. LCP housing and cover withstand high-temperature soldering environments, while gold-plated terminals provide secure electrical contact. Socket is rated at 0.5 A and 100 V.



Original Press Release:


Mobile Pentium* 4 Processor-M Socket from Molex Offers High-Density BGA Packaging


Achieve high-density Ball Grid Array packaging for the Intel* Mobile Pentium 4 Processor-M series with the new Micro PGA socket from Molex Incorporated. This socket is available in 478 circuits and can also be used with Intel Mobile Celeron* processors for applications such as blade servers or thin notebook PCs.

The socket's BGA solder balls are self-centering and help to prevent bent leads that can occur with standard SMT tails, especially in high pin count applications. BGA processing also provides good thermal control between components and the PCB for stable reflow soldering.

Molex's new Micro PGA socket has a profile height of only 3.30mm
(.130"), which is ideal for thin notebook PCs and servers. The socket is based on a 1.27mm (.050") grid array and accepts a PCB interposer that has the processor package mounted to it.

The interposer's Micro PGA pins are inserted into the Molex socket and a ZIF (Zero Insertion Force) actuation cover engages the contacts by simply turning a CAM mechanism with a standard screwdriver. The CAM mechanism includes a stainless steel retainer that protects the housing from wear.

Other features of the new socket include a dual-beam chamfered contact design that provides low insertion force and reliable electrical performance. The LCP housing and cover can withstand high-temperature soldering environments, while gold-plated terminals provide smooth engagement and secure electrical contact. This new socket is rated at 0.5A and 100V. It can be ordered in tray or tape-and-reel packaging, with a vacuum cover for automated placement.

Pricing for this product depends on quantity. For example, when
purchased in quantities of 25,000, this Micro PGA socket cost $10.40 each. Typical lead time is six to eight weeks.

Molex Incorporated is a 64-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 54 manufacturing facilities in 19 countries. The Molex Website address is www.molex.com.

* Intel, Pentium and Celeron are registered trademarks of Intel Corporation

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