Master Bond, Inc.

Epoxy Adhesive bonds to similar and dissimilar substrates.
Adhesives & Sealants

Epoxy Adhesive bonds to similar and dissimilar substrates.

Two-component, nickel-filled, electrically-conductive adhesive, Type EP76M features volume resistivity of 5-10 ohm-cm and thermal conductivity of 8-9 BTU/in./ftÂ-²/hr/°F. Product develops tensile shear strength of 2,000 psi when measured and cured at room temperature. Adhesive is 100% reactive, does not contain dilutents or solvents, and offers thermal shock and chemical resistance....

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Epoxy Adhesive cures in 5 minutes.
Adhesives & Sealants

Epoxy Adhesive cures in 5 minutes.

With 1:1 mix ratio, EP51ND 2-component epoxy adhesive can be applied on vertical surfaces without dripping or flowing. It spreads evenly and smoothly, and only contact pressure is required for cure. Product gels in ~5 min and cures fully at ambient temperatures. Bonded parts can be safely handled within Â-½ hr. Adhesive exhibits thermal shock and chemical resistance, and hardened product...

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Elastomer offers abrasion and chemical resistance.
Materials

Elastomer offers abrasion and chemical resistance.

Type EP30D-9 cures at room temperature or more rapidly at elevated temperatures. It has 100:15 mix ratio by weight and can be applied evenly on vertical surfaces without dripping. Suited for bonding, sealing, casting, and encapsulation, compound resists exposure to water, salts, alkalis, and acids over temperature range of -60 to 250°F. Bonds are resistant to vibration, impact, and shock....

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Thermally Conductive Adhesive features 1:1 mix ratio.
Adhesives & Sealants

Thermally Conductive Adhesive features 1:1 mix ratio.

Two-component, electrically-isolating, EP21AO epoxy adhesive will adhere to similar and dissimilar substrates. Self-leveling paste is 100% reactive and does not contain solvents or volatiles. It has thermal conductivity of 10 BTU/in./ftÂ-²/hr/°F and dielectric strength greater than 400 V/mil. Available in pt, qt, gal, and 5-gal kits, product features Shore D hardness greater than 85,...

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One Part Epoxy bonds similar and dissimilar metals.
Adhesives & Sealants

One Part Epoxy bonds similar and dissimilar metals.

Supreme 10HT adhesive resists mechanical vibration, impact, and shock; requires no mixing; and cures at temperatures above 250°F. Single component system can be stored at ambient temperatures and has min storage stability of 3 months up to max of 6 months without refrigeration. Product passes NASA outgassing test requirements and has operating temperature range of 4°K to 400°F....

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Adhesives & Sealants

Epoxy Film features high electrical conductivity.

Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is...

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Adhesive/Sealent has temperature range of -300 to +300°F.
Adhesives & Sealants

Adhesive/Sealent has temperature range of -300 to +300°F.

Master Bond Polymer System Supreme 10HTFL one component, flexible, epoxy resin based adhesive/sealant cures to flexible thermoset polymer at temperatures of 250-300°F and above and does not require refrigeration for extended storage before use. It adheres to metallic and non-metallic substrates and exhibits tensile lap shear strengths of more than 2,000 psi and T-peels in excess of 60 pli....

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Epoxy Adhesive offers high flexibility.
Adhesives & Sealants

Epoxy Adhesive offers high flexibility.

Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30-40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is...

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Adhesives & Sealants

Adhesive resists temperatures to 400°F.

Room temperature curing EP21HT, 2-component epoxy adhesive, has 1:1 mix ratio, weight or volume. It is 100% reactive and contains no solvents or volatiles. With service operating temperature range of -60 to +400°F, product bonds to similar and dissimilar substrates including metals, glass, ceramics, wood, rubbers, and plastics. Characteristics include volume resistivity of >1014 ohm-cm,...

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