Master Bond, Inc.

Thermal Adhesive Film provides electrical insulation.
Adhesives & Sealants

Thermal Adhesive Film provides electrical insulation.

Formulated to function as preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices, FL901AO epoxy film can cure in 1 hr at 250°F or 30-40 min at 300°F. B-stage, 100% solid adhesive-preform offers thermal conductivity of 10 BTUoin./ftÂ-²hr°F and volume resistivity exceeding 10 x 1012 W-cm, providing no-mess solution to...

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Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Adhesives & Sealants

Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components

HACKENSACK, NJ - Sept 10, 2009 - Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various...

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PCB Conformal Coating cures tack free in less than 5 min.
Paints & Coatings

PCB Conformal Coating cures tack free in less than 5 min.

With ability to maintain low modulus over temperature range of -65 to +200°C, Master Sil 773 is formulated to provide protection to electronic circuitry in high humidity environments as well as upon exposure to shock and vibration. One part, ultra low viscosity silicone conformal coating can be applied by dipping, spraying, brushing. Coating offers volume resistivity of 1x1014 W-cm, dielectric...

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Epoxy Adhesive features high thermal conductivity.
Adhesives & Sealants

Epoxy Adhesive features high thermal conductivity.

Suited for bonding, sealing, and potting applications, EP30BN optimizes heat dissipation of aerospace, defense, and microelectronic assemblies with minimal weight penalty. Two part boron nitride epoxy adhesive features electrical insulation properties with volume resistivity in excess of 1,014 Wcm and thermal conductivity of 24 Btu/hr/ftÂ-²/°F/in. Mechanical strength properties and...

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Epoxy Adhesive contains no volatiles or hazardous solvents.
Adhesives & Sealants

Epoxy Adhesive contains no volatiles or hazardous solvents.

Exhibiting low shrinkage and offering Tg that exceeds 94°C, epoxy adhesive UV10TK40 offers tensile strength of 8,300 psi and shore D hardness greater than 75, forming high surface hardness. It cures tack free in presence of air and will gel rapidly upon UV light exposure. Environmentally-friendly and 100% reactive, UV cure adhesive is suited for clear coating, sealing and bonding, and any...

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Epoxy System is reinforced with nanosilica fillers.
Adhesives & Sealants

Epoxy System is reinforced with nanosilica fillers.

Type UV22 features nano-sized filler (less than 50 nm) that provides cured system with abrasion resistance, optical clarity, low shrinkage, and physical strength, while maintaining low viscosity of 4,000 cps. UV22 cures rapidly upon exposure to UV light at room temperatures, has tensile strength greater than 4,600 psi and tensile modulus greater than 500,000 psi. Single component system has...

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Revolutionary Polyethylene Adhesive Requires No Pretreatment
Adhesives & Sealants

Revolutionary Polyethylene Adhesive Requires No Pretreatment

Master Bond MB514 polyethylene adhesive etches away at the bonding challenges presented by non-polar and low energy polyolefin surfaces. Typically, a pretreatment stage, which may include flame treatment, etching or roughening, is required before being able to bond polyolefin substrates. Specially formulated to eliminate this time consuming stage, the MB514 polyolefin based hot melt is...

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Thermal Conductive Epoxy Adhesive cures at room temperature.
Adhesives & Sealants

Thermal Conductive Epoxy Adhesive cures at room temperature.

Exhibiting thermal conductivity and electrical insulation properties, EP21TCHT-1 offers service operating temperature range of 4 K to 400°F. It adheres to metals, ceramics, woods, vulcanized rubbers, and most plastics, and provides bonds resistant to water, fuels, and most organic solvents. NASA qualified for low outgassing applications, adhesive is suited for use in vacuum environments....

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Silicone Adhesive is formulated for optimal optical bonding.
Adhesives & Sealants

Silicone Adhesive is formulated for optimal optical bonding.

Suited for optical potting, casting, and encapsulation, transparent low viscosity 2-part silicone adhesive MS151 features refractive index of 1.43 and operating temperature range of 65 to +400°F. It cures at room temperature to optically clear silicone rubber, providing electrical insulation as well as resistance to vibration, impact, shock, and thermal cycling. Adhesive has dielectric...

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